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MSP430G2302IPW20R

Texas Instruments

MSP430G2302IPW20R by Texas Instruments

MSP430G2302IPW20R by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. Features include 4 timers, I2C/SPI/USI connectivity, and DMA channels for efficient data transfer.

Median Price

$1.342

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 176,745 parts In-Stock

1+ parts

$1.074

100+ parts

$0.827

1k+ parts

$0.435

10k+ parts

-

176,745

$1.074

$0.827

$0.435

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$1.610

100+ parts

$0.949

1k+ parts

$0.847

10k+ parts

$0.770

3

$1.610

$0.949

$0.847

$0.770

DigiKey

USA . 771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

771

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,225 parts In-Stock

1+ parts

$1.020

100+ parts

-

1k+ parts

-

10k+ parts

-

1,225

$1.020

-

-

-

Vyrian

USA . 8,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,860

-

-

-

-

Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 58,878 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

-

10k+ parts

-

58,878

$0.910

-

-

-

Corphita

USA . 1,779 parts In-Stock

1+ parts

$0.967

100+ parts

-

1k+ parts

-

10k+ parts

-

1,779

$0.967

-

-

-

Microchip USA

USA . 1,105 parts In-Stock

1+ parts

$3.530

100+ parts

$3.510

1k+ parts

$3.500

10k+ parts

$3.490

1,105

$3.530

$3.510

$3.500

$3.490

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$52.017

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$52.017

-

-

-

DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$57.277

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$57.277

-

-

-

ChromeModa Solutions

Germany . 6,933 parts In-Stock

1+ parts

$58.446

100+ parts

$47.926

1k+ parts

-

10k+ parts

-

6,933

$58.446

$47.926

-

-

IDEA Electronic Components Group

UK . 249 parts In-Stock

1+ parts

$58.446

100+ parts

$55.524

1k+ parts

$52.601

10k+ parts

-

249

$58.446

$55.524

$52.601

-

A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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Kepictronics

USA . 1,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,843

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Discover the Texas Instruments MSP430G2302IPW20R, a top-of-the-line microcontroller that offers unparalleled quality and innovation. Proudly manufactured by Texas Instruments, this small outline package delivers outstanding performance and reliability. Ideal for a wide range of industrial applications, this microcontroller features advanced peripherals like BOD, DMA, TIMER, and WDT, ensuring seamless connectivity and functionality. With low power mode capabilities and a flash ROM programmability, the MSP430G2302IPW20R provides exceptional value and benefits to customers seeking cutting-edge technology. Unlock endless possibilities with this remarkable product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Ease of installation and space-saving design for applications where size is a critical factor.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, allowing for flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wider data RAM allows for faster processing and storage capabilities.

Package Shape: RECTANGULAR

Standard shape for easy integration into various PCB designs.

Bit Size: 16

16-bit architecture provides higher computational power and precision.

Terminal Form: GULL WING

Gull-wing terminals offer reliable solder connections and ease of assembly.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient execution of instructions, making it suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments with extended temperature ranges.

Connectivity: I2C, SPI, USI

Support for popular communication protocols enhances compatibility and connectivity options.

Technical Specifications

Microcontrollers MSP430G2302IPW20R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Trade Compliance

MSP430G2302IPW20R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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