Loading...

MSP430G2302IPW1REP

Texas Instruments

MSP430G2302IPW1REP by Texas Instruments

MSP430G2302IPW1REP by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM, 256B RAM, and 8-Ch 10-Bit ADC. Ideal for industrial applications due to its low power mode, peripherals like BOD and TIMER, and connectivity options such as I2C and SPI. Operating temperature range from -40°C to 85°C makes it suitable for various environments.

Median Price

$3.818

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,481 parts In-Stock

1+ parts

$3.818

100+ parts

$3.345

1k+ parts

$1.890

10k+ parts

-

9,481

$3.818

$3.345

$1.890

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,343 parts In-Stock

1+ parts

$3.627

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

$3.627

-

-

-

Vyrian

USA . 4,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,287

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 218 parts In-Stock

1+ parts

$3.436

100+ parts

-

1k+ parts

-

10k+ parts

-

218

$3.436

-

-

-

AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$14.130

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$14.130

-

-

-

Microchip USA

USA . 2,452 parts In-Stock

1+ parts

$16.500

100+ parts

$16.400

1k+ parts

$16.350

10k+ parts

$16.300

2,452

$16.500

$16.400

$16.350

$16.300

Parana Technologies

USA . 108 parts In-Stock

1+ parts

$64.742

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$64.742

-

-

-

ChromeModa Solutions

Germany . 1,976 parts In-Stock

1+ parts

$72.744

100+ parts

$59.650

1k+ parts

-

10k+ parts

-

1,976

$72.744

$59.650

-

-

IDEA Electronic Components Group

UK . 1,174 parts In-Stock

1+ parts

$72.744

100+ parts

$69.107

1k+ parts

$65.470

10k+ parts

-

1,174

$72.744

$69.107

$65.470

-

Component Stockers USA

USA . 8,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,469

-

-

-

-

DigiPath Technology Company

USA . 1,210 parts In-Stock

1+ parts

-

100+ parts

$65.586

1k+ parts

-

10k+ parts

-

1,210

-

$65.586

-

-

Overview

Unleash the power of innovation with the MSP430G2302IPW1REP by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. With a strong reputation for quality and reliability, Texas Instruments delivers excellence in every aspect, ensuring top-notch performance for your applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this versatile microcontroller offers unmatched value, efficiency, and flexibility. Say goodbye to limitations and embrace the endless possibilities with the MSP430G2302IPW1REP. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material makes the product lightweight and durable, ideal for applications where weight and reliability are important.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources, providing flexibility in different applications.

Bit Size: 16

With a bit size of 16, this microcontroller offers sufficient processing power for a variety of tasks, making it suitable for diverse projects.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately convert analog signals to digital data, expanding its capabilities in data acquisition applications.

Connectivity: I2C, SPI

Support for I2C and SPI connectivity ensures compatibility with a wide range of peripherals and devices, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430G2302IPW1REP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2302IPW1REP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20