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MSP430G2253IPW28

Texas Instruments

MSP430G2253IPW28 by Texas Instruments

MSP430G2253IPW28 by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM and 256B RAM. It operates at a max frequency of 16MHz, suitable for industrial applications requiring low power consumption. Features include 8-channel ADC, dual DMA channels, and connectivity options like I2C, SPI, and UART.

Median Price

$1.398

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,900 parts In-Stock

1+ parts

$1.398

100+ parts

$1.154

1k+ parts

$0.624

10k+ parts

-

8,900

$1.398

$1.154

$0.624

-

Mouser Electronics

USA . 462 parts In-Stock

1+ parts

$2.130

100+ parts

$1.280

1k+ parts

$1.180

10k+ parts

$1.130

462

$2.130

$1.280

$1.180

$1.130

DigiKey

USA . 422 parts In-Stock

1+ parts

$2.130

100+ parts

$1.284

1k+ parts

$1.211

10k+ parts

-

422

$2.130

$1.284

$1.211

-

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

350

-

$1.220

$1.010

$0.903

Verical

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

$1.129

350

-

-

$1.262

$1.129

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,583 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

-

1,583

$0.824

-

-

-

Vyrian

USA . 4,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,335

-

-

-

-

DigiKey Marketplace

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.900

1k+ parts

-

10k+ parts

-

350

-

$0.900

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,467 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

-

2,467

$0.740

-

-

-

Corphita

USA . 4,817 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

$0.780

-

-

-

Microchip USA

USA . 1,698 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,698

$5.850

-

-

-

Parana Technologies

USA . 1,707 parts In-Stock

1+ parts

$53.408

100+ parts

-

1k+ parts

-

10k+ parts

-

1,707

$53.408

-

-

-

DigiPath Technology Company

USA . 1,345 parts In-Stock

1+ parts

$58.809

100+ parts

$54.104

1k+ parts

-

10k+ parts

-

1,345

$58.809

$54.104

-

-

ChromeModa Solutions

Germany . 5,356 parts In-Stock

1+ parts

$60.009

100+ parts

$49.207

1k+ parts

-

10k+ parts

-

5,356

$60.009

$49.207

-

-

IDEA Electronic Components Group

UK . 2,338 parts In-Stock

1+ parts

$60.009

100+ parts

$57.009

1k+ parts

$54.008

10k+ parts

-

2,338

$60.009

$57.009

$54.008

-

Overview

Unlock the potential of your electronics projects with the MSP430G2253IPW28 by Texas Instruments. As a trusted manufacturer of high-quality microcontrollers, Texas Instruments delivers unparalleled reliability and performance. This versatile product is perfect for a wide range of applications, offering customers value through its low power consumption, advanced features, and seamless connectivity options. Experience the benefits of this cutting-edge technology and take your projects to the next level with the MSP430G2253IPW28.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy material, this Microcontroller is lightweight and durable, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this Microcontroller can handle higher power requirements and voltages, allowing for flexibility in design.

Bit Size: 16

The 16-bit architecture of this Microcontroller enables it to process and handle data more efficiently and accurately than lower-bit models.

ADC Channels: YES

Having Analog to Digital Converter channels allows this Microcontroller to interface with analog sensors and devices, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC (Reduced Instruction Set Computing) architecture in a microcontroller results in faster and more efficient data processing, making it ideal for tasks that require quick response times.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

With a variety of connectivity options like I2C, IRDA, LIN, SPI, UART, and USCI, this Microcontroller can easily communicate with different devices and peripherals, enhancing its versatility.

ROM Programmability: FLASH

Having Flash ROM programmability means that this Microcontroller can be easily reprogrammed and updated without needing specialized equipment, making it convenient for development and testing.

Low Power Mode: YES

The low power mode feature of this Microcontroller allows for power-efficient operation, extending battery life and reducing energy consumption, making it suitable for portable and battery-powered applications.

Technical Specifications

Microcontrollers MSP430G2253IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2253IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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