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MSP430G2252TDA2

Texas Instruments

MSP430G2252TDA2 by Texas Instruments

MSP430G2252TDA2 by Texas Instruments is a 16-bit microcontroller with 22 terminals, operating at 1.8-3.6V. It features ADC channels, I2C/SPI connectivity, and low power mode ideal for IoT applications requiring efficient processing and communication in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,911 parts In-Stock

1+ parts

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2,911

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Digiode

USA . 914 parts In-Stock

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914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,354 parts In-Stock

1+ parts

$15.000

100+ parts

-

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1,354

$15.000

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AZTECH Wire

Italy . 661 parts In-Stock

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$15.478

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661

$15.478

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Microchip USA

USA . 2,360 parts In-Stock

1+ parts

$33.070

100+ parts

$32.600

1k+ parts

$32.360

10k+ parts

$32.120

2,360

$33.070

$32.600

$32.360

$32.120

Parana Technologies

USA . 1,308 parts In-Stock

1+ parts

$40.418

100+ parts

$3,753.467

1k+ parts

$36.377

10k+ parts

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1,308

$40.418

$3,753.467

$36.377

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DigiPath Technology Company

USA . 1,995 parts In-Stock

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$44.506

100+ parts

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1,995

$44.506

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ChromeModa Solutions

Germany . 5,652 parts In-Stock

1+ parts

$45.414

100+ parts

$37.239

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5,652

$45.414

$37.239

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

1+ parts

$45.414

100+ parts

$43.143

1k+ parts

$40.873

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2,005

$45.414

$43.143

$40.873

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Corphita

USA . 1,741 parts In-Stock

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1,741

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Overview

Enhance your projects with the MSP430G2252TDA2 by Texas Instruments, a high-quality microcontroller that offers unparalleled efficiency and performance. With a wide range of applications in various industries, this product boasts advanced features such as low power mode, ADC channels, and connectivity options like I2C and SPI. Trust in the renowned manufacturer, Texas Instruments, to deliver exceptional value and reliability in every product they create. Experience the benefits of seamless integration, optimal speed, and versatile peripherals - all in a compact and convenient package. Elevate your designs with the MSP430G2252TDA2 and unlock endless possibilities today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and providing efficient connections.

Maximum Supply Voltage: 3.6 V

Provides a wide range of voltage input options for versatility in powering the microcontroller.

Package Shape: RECTANGULAR

Rectangular shape simplifies the design and layout of the circuit board for easy integration.

Bit Size: 16

16-bit processing capability enables efficient handling of data and instructions for faster performance.

No. of Terminals: 22

Sufficient number of terminals for versatile connectivity options and interfacing with other components.

Package Style (Meter): UNCASED CHIP

Uncased chip package style provides flexibility in mounting options and allows for customization based on project requirements.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage ensures efficient power consumption and operation in low power scenarios.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it suitable for a wide range of applications.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate conversion of analog signals to digital data for sensor interfacing and measurement applications.

Terminal Position: UPPER

Upper terminal position facilitates easy access to terminals for connectivity and debugging purposes.

Peripherals: BOD, COMPARATOR, TIMER

Built-in peripherals such as brown-out detection, comparator, and timer enhance the functionality and versatility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller's peripheral IC type ensures efficient processing and execution of instructions for optimized performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption, high speed, and reliability for the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering processes and ensures reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

Connectivity: I2C, SPI

Support for I2C and SPI connectivity standards allows for easy communication with external devices and peripherals.

Format: FLOATING POINT

Floating point format supports accurate floating-point arithmetic operations for complex calculations and data processing.

Speed: 16 rpm

16 revolutions per minute speed capability for efficient processing and execution of tasks within specified timeframes.

Low Power Mode: YES

Low power mode functionality enables power-saving operation for extended battery life and energy efficiency.

No. of I/O Lines: 16

Sufficient number of input/output lines for versatile interfacing and connectivity with external devices and sensors.

Technical Specifications

Microcontrollers MSP430G2252TDA2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-XUUC-N22

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

22

No. of Timers:

0

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

0

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, COMPARATOR, TIMER

Trade Compliance

MSP430G2252TDA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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