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MSP430G2252TDA1

Texas Instruments

MSP430G2252TDA1 by Texas Instruments

MSP430G2252TDA1 by Texas Instruments is a 16-bit microcontroller with 22 terminals, operating at speeds up to 16 rpm. It features low power mode, I2C and SPI connectivity, and peripherals like BOD, COMPARATOR, TIMER. Ideal for applications requiring low power consumption and high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,723 parts In-Stock

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Digiode

USA . 3,570 parts In-Stock

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3,570

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Distributors (Availability)

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$8.654

100+ parts

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222

$8.654

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Microchip USA

USA . 2,299 parts In-Stock

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$10.270

100+ parts

$10.210

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$10.180

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$10.140

2,299

$10.270

$10.210

$10.180

$10.140

One Stop Electronics

USA . 598 parts In-Stock

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$20.000

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598

$20.000

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Parana Technologies

USA . 2,270 parts In-Stock

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$75.113

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2,270

$75.113

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DigiPath Technology Company

USA . 2,048 parts In-Stock

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$82.709

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$76.092

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2,048

$82.709

$76.092

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ChromeModa Solutions

Germany . 1,349 parts In-Stock

1+ parts

$84.397

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$69.206

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1,349

$84.397

$69.206

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IDEA Electronic Components Group

UK . 956 parts In-Stock

1+ parts

$84.397

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$80.177

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$75.957

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956

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$75.957

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Corphita

USA . 4,076 parts In-Stock

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Overview

Unlock endless possibilities with the MSP430G2252TDA1 by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From IoT devices to consumer electronics, this product delivers exceptional performance while consuming minimal power. Experience seamless connectivity with I2C and SPI interfaces, along with advanced peripherals like BOD and TIMER. Trust in Texas Instruments to provide you with the tools you need to bring your innovative ideas to life. Elevate your designs with the MSP430G2252TDA1 today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different system designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards.

Bit Size: 16

16-bit architecture provides high performance and precision in computing tasks.

No. of Terminals: 22

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style (Meter): UNCASED CHIP

Uncased chip design enables compact integration and reduces overall size of the product.

Minimum Supply Voltage: 1.8 V

Supports low power operation with a minimum supply voltage of 1.8V, ideal for battery-powered devices.

CPU Family: MSP430

MSP430 CPU family offers low power consumption and high performance suitable for a variety of applications.

ADC Channels: YES

Analog-to-digital converter channels enable measurement and processing of analog signals.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection in circuit board layout.

Peripherals: BOD, COMPARATOR, TIMER

Includes built-in peripherals like Brown-Out Detector, Comparator, and Timer for enhanced functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high speed and efficiency in processing instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of damage during handling and assembly.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent performance under varying conditions.

Connectivity: I2C, SPI

Support for I2C and SPI connectivity interfaces for communication with peripheral devices.

Format: FLOATING POINT

Floating point format allows for high precision calculations in numerical operations.

Speed: 16 rpm

Operates at a speed of 16 rpm, suitable for handling real-time data processing tasks efficiently.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption and extending battery life.

No. of I/O Lines: 16

Sufficient number of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430G2252TDA1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-XUUC-N22

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

22

No. of Timers:

0

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

0

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, COMPARATOR, TIMER

Trade Compliance

MSP430G2252TDA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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