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MSP430G2233IN20

Texas Instruments

MSP430G2233IN20 by Texas Instruments

MSP430G2233IN20 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It features 8 ADC channels, 6 timers, and low power mode for industrial applications. With a max clock frequency of 0.032 MHz, it offers connectivity options like I2C, IRDA, SPI(2), UART, USCI(2) for efficient data transfer.

Median Price

$2.012

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,570 parts In-Stock

1+ parts

$1.743

100+ parts

$1.439

1k+ parts

$0.778

10k+ parts

-

5,570

$1.743

$1.439

$0.778

-

DigiKey

USA . 460 parts In-Stock

1+ parts

$2.280

100+ parts

$1.378

1k+ parts

$1.215

10k+ parts

$1.150

460

$2.280

$1.378

$1.215

$1.150

Mouser Electronics

USA . 98 parts In-Stock

1+ parts

$2.280

100+ parts

$1.370

1k+ parts

$1.170

10k+ parts

$1.130

98

$2.280

$1.370

$1.170

$1.130

Rochester

USA . 388 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.100

10k+ parts

$1.030

388

-

$1.230

$1.100

$1.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,432 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3,432

$1.120

-

-

-

Digiode

USA . 2,493 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

-

10k+ parts

-

2,493

$1.121

-

-

-

ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Bristol Electronics

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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160

-

-

-

-

Dan-Mar Components

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,625 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

-

10k+ parts

-

2,625

$1.062

-

-

-

Component Stockers USA

USA . 6,761 parts In-Stock

1+ parts

$1.110

100+ parts

$1.050

1k+ parts

$0.840

10k+ parts

-

6,761

$1.110

$1.050

$0.840

-

Microchip USA

USA . 1,845 parts In-Stock

1+ parts

$7.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,845

$7.280

-

-

-

Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

$16.830

100+ parts

$15.315

1k+ parts

$13.801

10k+ parts

-

63

$16.830

$15.315

$13.801

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Parana Technologies

USA . 679 parts In-Stock

1+ parts

$70.165

100+ parts

-

1k+ parts

-

10k+ parts

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679

$70.165

-

-

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DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$77.260

100+ parts

$71.079

1k+ parts

-

10k+ parts

-

993

$77.260

$71.079

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-

ChromeModa Solutions

Germany . 1,675 parts In-Stock

1+ parts

$78.837

100+ parts

$64.646

1k+ parts

-

10k+ parts

-

1,675

$78.837

$64.646

-

-

IDEA Electronic Components Group

UK . 699 parts In-Stock

1+ parts

$78.837

100+ parts

$74.895

1k+ parts

$70.953

10k+ parts

-

699

$78.837

$74.895

$70.953

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430G2233IN20 microcontroller. Built with precision and expertise, this device offers unmatched quality and reliability for a wide range of applications. From smart home devices to industrial automation, this microcontroller delivers superior performance and efficiency. With low power consumption and versatile connectivity options, the MSP430G2233IN20 provides exceptional value and benefits to customers looking to push the boundaries of technology. Experience the next level of control and functionality with Texas Instruments' cutting-edge microcontroller technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection and durability for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage capabilities within the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate the microcontroller into different circuit designs and layouts.

Bit Size: 16

The 16-bit size allows for higher data processing capabilities and efficiency in executing various operations.

Power Supplies (V): 2/3.3

The dual power supply options of 2V and 3.3V provide flexibility in power management and compatibility with different voltage requirements.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for peripherals and external components, enhancing the functionality of the microcontroller.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage sources, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions and high-temperature applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430G2233IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

24.33 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

2

No. of Terminals:

20

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.35 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2233IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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