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MSP430G2231IRSAQ1

Texas Instruments

MSP430G2231IRSAQ1 by Texas Instruments

MSP430G2231IRSAQ1 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and a max clock frequency of 16 MHz. It is suitable for industrial applications requiring low power consumption and features like ADC and DMA channels. The chip carrier package style with a very thin profile makes it ideal for compact designs in automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,714 parts In-Stock

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4,714

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Digiode

USA . 78 parts In-Stock

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78

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AZTECH Wire

Italy . 329 parts In-Stock

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$9.391

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329

$9.391

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One Stop Electronics

USA . 281 parts In-Stock

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$30.000

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Parana Technologies

USA . 1,487 parts In-Stock

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$64.215

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ChromeModa Solutions

Germany . 4,007 parts In-Stock

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$72.152

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$59.165

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IDEA Electronic Components Group

UK . 372 parts In-Stock

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$72.152

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$68.544

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$64.937

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372

$72.152

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$64.937

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Corphita

USA . 2,831 parts In-Stock

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DigiPath Technology Company

USA . 1,917 parts In-Stock

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$65.052

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Microchip USA

USA . 422 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430G2231IRSAQ1 microcontroller. Designed with precision and reliability in mind, this device is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With its cutting-edge technology and advanced features, this microcontroller offers unmatched value and performance to customers looking to take their projects to the next level. Trust Texas Instruments to deliver quality products that exceed expectations and bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for a variety of applications without adding unnecessary weight.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and making the overall design more compact.

Screening Level: AEC-Q100

This screening level ensures that the microcontroller meets high automotive quality standards, making it reliable for automotive applications.

Bit Size: 16

The 16-bit architecture provides better performance and allows for more complex calculations compared to lower bit sizes.

Power Supplies (V): 2/3.3

The dual power supply options offer flexibility in design and compatibility with different voltage requirements in various applications.

No. of Terminals: 16

Having 16 terminals provides enough connectivity options for interfacing with other components and peripherals in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the microcontroller can function reliably in harsh environmental conditions without overheating.

CPU Family: MSP430

Being part of the MSP430 family means the microcontroller offers low power consumption and high performance, making it energy-efficient and suitable for battery-powered devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient and quick execution of instructions, enhancing the overall performance of the device.

RAM Bytes: 128

With 128 bytes of RAM, the microcontroller can handle data processing and storage efficiently, allowing for smooth operation of the system.

Technical Specifications

Microcontrollers MSP430G2231IRSAQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2231IRSAQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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