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MSP430G2221IPW4Q1

Texas Instruments

MSP430G2221IPW4Q1 by Texas Instruments

MSP430G2221IPW4Q1 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications, it features ADC and DMA channels, operates at -40 to 85°C, and consumes only 0.37 mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,914 parts In-Stock

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Vyrian

USA . 2,633 parts In-Stock

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One Stop Electronics

USA . 1,294 parts In-Stock

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$14.000

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AZTECH Wire

Italy . 513 parts In-Stock

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$15.960

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Parana Technologies

USA . 2,313 parts In-Stock

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$36.501

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DigiPath Technology Company

USA . 197 parts In-Stock

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$40.192

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$36.976

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ChromeModa Solutions

Germany . 5,832 parts In-Stock

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$41.012

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$33.630

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

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$41.012

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$38.961

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$36.911

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Corphita

USA . 3,708 parts In-Stock

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the MSP430G2221IPW4Q1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. Whether you're looking to enhance your industrial processes or create innovative IoT solutions, this product offers unmatched value and performance. With features like low power consumption and high-speed operation, the MSP430G2221IPW4Q1 is designed to meet your needs and exceed your expectations. Trust Texas Instruments to provide reliable, efficient solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the microcontroller meets automotive industry standards for quality and reliability.

Bit Size: 16

16-bit architecture provides enhanced performance and processing capabilities for the microcontroller.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 14

Having 14 terminals enables connectivity with various external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile and shrink pitch saves space on the PCB and enhances overall design aesthetics.

CPU Family: MSP430

MSP430 CPU family is known for its low-power consumption and high performance, making it a suitable choice for energy-efficient applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable operation in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without sacrificing performance.

ADC Channels: YES

Built-in ADC channels enable analog sensor data to be converted to digital signals, expanding the range of applications for the microcontroller.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and frees up the CPU for other tasks, improving overall system performance.

ROM Words: 2048

With 2048 ROM words, the microcontroller offers ample storage space for program instructions and data, enabling complex algorithms to be executed efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller's peripheral IC type provides fast and efficient execution of instructions, resulting in high-performance computing capabilities.

RAM Bytes: 128

128 bytes of RAM provide temporary storage for data and variables during program execution, enhancing the microcontroller's multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz allows for fast execution of instructions and efficient processing of data, improving overall system performance.

Technical Specifications

Microcontrollers MSP430G2221IPW4Q1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2221IPW4Q1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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