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MSP430G2211IPW4RQ1

Texas Instruments

MSP430G2211IPW4RQ1 by Texas Instruments

Texas Instruments' MSP430G2211IPW4RQ1 is an AEC-Q100 compliant microcontroller with CMOS technology. It features a peak reflow temperature of 260°C, 30s max time at peak reflow temp, and nickel palladium gold terminal finish. Ideal for automotive applications requiring robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,126 parts In-Stock

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Digiode

USA . 4,291 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 547 parts In-Stock

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$9.403

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547

$9.403

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One Stop Electronics

USA . 1,378 parts In-Stock

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$31.000

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$31.000

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Parana Technologies

USA . 512 parts In-Stock

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$58.731

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512

$58.731

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DigiPath Technology Company

USA . 1,954 parts In-Stock

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$64.670

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1,954

$64.670

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ChromeModa Solutions

Germany . 5,788 parts In-Stock

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$65.990

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$54.112

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5,788

$65.990

$54.112

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IDEA Electronic Components Group

UK . 940 parts In-Stock

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$65.990

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$62.690

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$59.391

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940

$65.990

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$59.391

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Corphita

USA . 3,458 parts In-Stock

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Microchip USA

USA . 238 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MSP430G2211IPW4RQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. Whether you're working on IoT devices, wearables, or smart home systems, this microcontroller offers unmatched value, efficiency, and reliability. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product has undergone rigorous testing and certification processes to ensure its reliability and durability, making it suitable for automotive applications where high performance is essential.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent corrosion resistance and solderability, ensuring a reliable and long-lasting connection in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product offers a stable and consistent soldering process, leading to improved manufacturing efficiency and quality control.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the microcontroller, ensuring proper bonding of components and reducing the risk of solder joint failures.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC architecture, this microcontroller offers high performance and energy efficiency for a wide range of embedded applications, making it a versatile choice for various electronic devices.

Technology: CMOS

Built on CMOS technology, this microcontroller delivers low power consumption, high speed operation, and robust performance, making it an ideal solution for battery-powered devices and other applications where power efficiency is crucial.

Technical Specifications

Microcontrollers MSP430G2211IPW4RQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430G2211IPW4RQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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