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MSP430G2211IPW4Q1

Texas Instruments

MSP430G2211IPW4Q1 by Texas Instruments

MSP430G2211IPW4Q1 by Texas Instruments is a 16-bit microcontroller with 128 bytes of RAM and 2048 ROM words. Operating at a max clock frequency of 0.05 MHz, it is suitable for industrial applications requiring low power consumption and PWM functionality. With a package style of small outline, thin profile, shrink pitch, this MCU offers dual terminal position and nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,748 parts In-Stock

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4,748

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Digiode

USA . 1,636 parts In-Stock

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1,636

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Distributors (Availability)

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One Stop Electronics

USA . 1,388 parts In-Stock

1+ parts

$3.000

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1,388

$3.000

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AZTECH Wire

Italy . 594 parts In-Stock

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$14.131

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594

$14.131

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Parana Technologies

USA . 114 parts In-Stock

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$63.496

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114

$63.496

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DigiPath Technology Company

USA . 1,017 parts In-Stock

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$69.917

100+ parts

$64.324

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1,017

$69.917

$64.324

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ChromeModa Solutions

Germany . 4,871 parts In-Stock

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$71.344

100+ parts

$58.502

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4,871

$71.344

$58.502

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

1+ parts

$71.344

100+ parts

$67.777

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$64.210

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1,843

$71.344

$67.777

$64.210

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Corphita

USA . 3,795 parts In-Stock

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Microchip USA

USA . 302 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2211IPW4Q1 microcontroller. Manufactured by a trusted leader in the industry, this versatile device offers endless possibilities for your projects. With its compact design and reliable performance, this microcontroller is perfect for a wide range of applications. Experience the value and benefits of seamless integration, efficient power management, and high-speed processing. Take your projects to the next level with the MSP430G2211IPW4Q1 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable or rugged applications.

Surface Mount: YES

SMD technology allows for smaller footprint and higher density designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, increasing compatibility.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality.

Bit Size: 16

16-bit architecture allows for more efficient processing and calculations.

Power Supplies (V): 2/3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 14

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving package design for tight layout requirements.

Minimum Supply Voltage: 3.3 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial environments.

CPU Family: MSP430

Known for low power consumption and high performance, ideal for battery-powered devices.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position for increased connectivity options.

ROM Words: 2048

Sufficient ROM size for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact width for efficient board layout.

Maximum Clock Frequency: 0.05 MHz

Supports high-speed operation for quick data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow process time to prevent damage during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for robust soldering.

Length: 5 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Meets industrial grade standards for reliability and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing and power management.

RAM Bytes: 128

Adequate RAM size for temporary data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure connections.

Maximum Supply Current: 0.37 mA

Low power consumption for energy-efficient operation.

PWM Channels: YES

Supports PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM for reprogrammable memory storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density board layouts.

Speed: 16 rpm

Operates at 16 rotations per minute for efficient data processing.

No. of I/O Lines: 10

Sufficient I/O lines for connecting external sensors and devices.

Technical Specifications

Microcontrollers MSP430G2211IPW4Q1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2211IPW4Q1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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