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MSP430G2203IPW28R

Texas Instruments

MSP430G2203IPW28R by Texas Instruments

MSP430G2203IPW28R by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$1.183

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,010 parts In-Stock

1+ parts

$1.183

100+ parts

$0.977

1k+ parts

$0.528

10k+ parts

-

11,010

$1.183

$0.977

$0.528

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,152 parts In-Stock

1+ parts

$1.124

100+ parts

-

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-

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3,152

$1.124

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Vyrian

USA . 8,752 parts In-Stock

1+ parts

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8,752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,015 parts In-Stock

1+ parts

$1.065

100+ parts

-

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-

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1,015

$1.065

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Microchip USA

USA . 2,188 parts In-Stock

1+ parts

$4.680

100+ parts

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2,188

$4.680

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AZTECH Wire

Italy . 408 parts In-Stock

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$10.310

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408

$10.310

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Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

$16.296

100+ parts

-

1k+ parts

$16.602

10k+ parts

-

1,160

$16.296

-

$16.602

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$17.944

100+ parts

$16.508

1k+ parts

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694

$17.944

$16.508

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ChromeModa Solutions

Germany . 3,163 parts In-Stock

1+ parts

$18.310

100+ parts

$15.014

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-

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3,163

$18.310

$15.014

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IDEA Electronic Components Group

UK . 663 parts In-Stock

1+ parts

$18.310

100+ parts

$17.394

1k+ parts

$16.479

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663

$18.310

$17.394

$16.479

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Kepictronics

USA . 17,116 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2203IPW28R microcontroller. Known for its top-notch quality and reliability, Texas Instruments delivers a product that exceeds expectations in various applications. From industrial automation to consumer electronics, this microcontroller offers unmatched value and benefits to customers. With features like low power mode, connectivity options, and flash programmability, the MSP430G2203IPW28R is the perfect choice for those seeking high performance in a compact package. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and efficiency.

CPU Family: MSP430

A well-established and reliable CPU family known for its low power consumption.

ROM Words: 2048

Provides ample storage capacity for program code.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI(2)

Support for various communication protocols enhances the product's versatility.

Speed: 16 rpm

Sufficient speed for many applications while maintaining low power consumption.

Low Power Mode: YES

Enables energy-efficient operation, crucial for battery-powered devices.

Technical Specifications

Microcontrollers MSP430G2203IPW28R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, TIMER(6), WDT"

Trade Compliance

MSP430G2203IPW28R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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