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MSP430G2201IRSAQ1

Texas Instruments

MSP430G2201IRSAQ1 by Texas Instruments

MSP430G2201IRSAQ1 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at a max clock frequency of 0.05 MHz, it is ideal for industrial applications requiring low power consumption and PWM functionality. With a package style of CHIP CARRIER, this CMOS technology-based MCU offers 10 I/O lines and operates within an industrial temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,818 parts In-Stock

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Digiode

USA . 1,260 parts In-Stock

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1,260

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Distributors (Availability)

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One Stop Electronics

USA . 459 parts In-Stock

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$5.000

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459

$5.000

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AZTECH Wire

Italy . 410 parts In-Stock

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$18.381

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410

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Parana Technologies

USA . 622 parts In-Stock

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$72.662

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622

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ChromeModa Solutions

Germany . 6,556 parts In-Stock

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$81.643

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$66.947

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6,556

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$66.947

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IDEA Electronic Components Group

UK . 591 parts In-Stock

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$81.643

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$77.561

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$73.479

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591

$81.643

$77.561

$73.479

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Corphita

USA . 2,478 parts In-Stock

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DigiPath Technology Company

USA . 468 parts In-Stock

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$73.609

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Microchip USA

USA . 160 parts In-Stock

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Overview

Unlock endless possibilities with the MSP430G2201IRSAQ1 microcontroller by Texas Instruments. Renowned for its high-quality manufacturing, this versatile chip offers a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With low power consumption, fast clock frequency, and 16-bit processing power, this microcontroller provides exceptional value and performance. Experience seamless integration and efficiency with the MSP430G2201IRSAQ1, setting new standards in innovation and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying design.

Maximum Supply Voltage: 3.6 V

Allows for versatility in power supply options and compatibility with various systems.

Screening Level: AEC-Q100

High level of quality and reliability, suitable for automotive applications.

Bit Size: 16

Offers a good balance of processing power and cost-effectiveness for many applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options for flexibility in system design.

No. of Terminals: 16

Provides sufficient connectivity for interfacing with other components in a system.

Minimum Supply Voltage: 3.3 V

Ensures reliable operation at low power supply levels.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient RISC architecture for high performance processing capabilities.

Technical Specifications

Microcontrollers MSP430G2201IRSAQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of I/O Lines:

10

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2201IRSAQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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