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MSP430G2152IPW20

Texas Instruments

MSP430G2152IPW20 by Texas Instruments

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.182

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,860 parts In-Stock

1+ parts

$1.243

100+ parts

$1.027

1k+ parts

$0.555

10k+ parts

-

4,860

$1.243

$1.027

$0.555

-

Rochester

USA . 2,590 parts In-Stock

1+ parts

-

100+ parts

$1.080

1k+ parts

$0.896

10k+ parts

$0.799

2,590

-

$1.080

$0.896

$0.799

DigiKey

USA . 2,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

-

2,590

-

-

$1.350

-

Verical

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.121

10k+ parts

$0.999

1,400

-

-

$1.121

$0.999

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,984 parts In-Stock

1+ parts

$0.732

100+ parts

-

1k+ parts

-

10k+ parts

-

1,984

$0.732

-

-

-

Vyrian

USA . 8,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,440

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 423 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$0.694

-

-

-

Microchip USA

USA . 2,562 parts In-Stock

1+ parts

$5.200

100+ parts

-

1k+ parts

-

10k+ parts

-

2,562

$5.200

-

-

-

Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

$45.639

100+ parts

-

1k+ parts

-

10k+ parts

-

2,299

$45.639

-

-

-

DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

$50.254

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$50.254

-

-

-

ChromeModa Solutions

Germany . 6,681 parts In-Stock

1+ parts

$51.280

100+ parts

$42.050

1k+ parts

-

10k+ parts

-

6,681

$51.280

$42.050

-

-

IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$51.280

100+ parts

$48.716

1k+ parts

$46.152

10k+ parts

-

910

$51.280

$48.716

$46.152

-

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$57.899

100+ parts

$52.688

1k+ parts

$47.477

10k+ parts

-

870

$57.899

$52.688

$47.477

-

Technical Specifications

Microcontrollers MSP430G2152IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2152IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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