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MSP430G2131IPW4Q1

Texas Instruments

MSP430G2131IPW4Q1 by Texas Instruments

MSP430G2131IPW4Q1 by Texas Instruments is a 16-bit microcontroller with 128 bytes of RAM and 1024 ROM words. It operates at a max frequency of 16 MHz, suitable for industrial applications requiring low power consumption (0.37 mA) and PWM channels for control.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,421 parts In-Stock

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Digiode

USA . 4,435 parts In-Stock

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AZTECH Wire

Italy . 581 parts In-Stock

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$8.735

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One Stop Electronics

USA . 563 parts In-Stock

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$26.000

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Parana Technologies

USA . 110 parts In-Stock

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$37.894

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ChromeModa Solutions

Germany . 3,671 parts In-Stock

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$42.578

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$34.914

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IDEA Electronic Components Group

UK . 1,127 parts In-Stock

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$42.578

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$40.449

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$38.320

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Component Stockers USA

USA . 457 parts In-Stock

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$99.990

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Microchip USA

USA . 5,700 parts In-Stock

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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DigiPath Technology Company

USA . 1,888 parts In-Stock

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Overview

Elevate your projects with the Texas Instruments MSP430G2131IPW4Q1 microcontroller. Designed with precision and quality in mind, this device offers unmatched performance and reliability for a wide range of applications. From IoT devices to robotics, this microcontroller provides exceptional value and benefits to customers looking for a compact yet powerful solution. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with the MSP430G2131IPW4Q1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Ensures high reliability and quality, making it suitable for automotive applications.

Bit Size: 16

Offers sufficient processing power for a wide range of applications.

Power Supplies (V): 2/3.3

Compatible with common voltage requirements in electronic devices.

No. of Terminals: 14

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables a compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

CPU Family: MSP430

Belongs to a reputable family of microcontrollers known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention, improving performance.

ROM Words: 1024

Offers sufficient memory for program storage.

Maximum Seated Height: 1.2 mm

Low-profile design suitable for thin electronic devices.

Width: 4.4 mm

Compact dimensions ideal for space-constrained applications.

Maximum Clock Frequency: 16 MHz

Provides high processing speed for real-time applications.

Length: 5 mm

Compact form factor for small electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for efficient and fast processing.

RAM Bytes: 128

Sufficient random-access memory for storing and processing data during operation.

Technology: CMOS

Complementary metal-oxide-semiconductor technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering during assembly.

Maximum Supply Current: 0.37 mA

Low power consumption for energy-efficient operation.

PWM Channels: YES

Supports pulse-width modulation for controlling motors and other devices.

ROM Programmability: FLASH

Allows for reprogramming of the memory to update firmware or add new features.

Technical Specifications

Microcontrollers MSP430G2131IPW4Q1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1024

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2131IPW4Q1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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