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MSP430G2113IN20

Texas Instruments

MSP430G2113IN20 by Texas Instruments

MSP430G2113IN20 by Texas Instruments is a 16-bit microcontroller with 256B RAM, 1024 ROM words, and 16MHz clock frequency. Ideal for industrial applications, it features BOR, 8 comparators, 6 timers, and low power mode to operate at -40 to 85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,137 parts In-Stock

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Digiode

USA . 2,873 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

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$8.536

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260

$8.536

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Microchip USA

USA . 1,203 parts In-Stock

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$16.280

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$16.180

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$16.130

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$16.080

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$16.280

$16.180

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$16.080

Ampacity Inc.

Singapore . 1,453 parts In-Stock

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$18.000

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One Stop Electronics

USA . 1,048 parts In-Stock

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$25.000

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$25.000

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Semicontronic

India . 1,191 parts In-Stock

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$33.000

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$32.175

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$32.010

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$33.000

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$32.010

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Parana Technologies

USA . 1,678 parts In-Stock

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$42.290

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ChromeModa Solutions

Germany . 3,942 parts In-Stock

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$47.517

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$38.964

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IDEA Electronic Components Group

UK . 956 parts In-Stock

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$47.517

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$45.141

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$42.765

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$42.765

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Corphita

USA . 4,529 parts In-Stock

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DigiPath Technology Company

USA . 1,048 parts In-Stock

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$42.841

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Corohmni

South Africa . 429 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430G2113IN20 microcontroller. This high-quality device offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value and benefits to customers. With its advanced features and cutting-edge technology, the MSP430G2113IN20 stands out as a top-of-the-line solution for all your microcontroller needs. Choose Texas Instruments for superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing flexibility in design.

Bit Size: 16

Offers a good balance between performance and power consumption for embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient and fast processing, making it suitable for real-time applications.

Analog To Digital Convertors: 16-Ch 12-Bit

High-resolution ADCs provide accurate conversion of analog signals, making this microcontroller ideal for sensing applications.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Support for a variety of communication protocols allows for easy integration with other devices and systems.

Low Power Mode: YES

Enables the microcontroller to operate in power-efficient modes, extending battery life in portable devices.

Technical Specifications

Microcontrollers MSP430G2113IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

2

No. of Terminals:

20

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART, USCI(2)

Peripherals:

BOR, COMPARATOR(8), TIMER(6), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430G2113IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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