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MSP430G2102IN20

Texas Instruments

MSP430G2102IN20 by Texas Instruments

MSP430G2102IN20 by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates b/w -40 to 85 °C, consuming only 0.4 mA at max supply voltage of 3.6 V. Ideal for low-power applications, it features BOD, DMA(1), TIMER(4), WDT peripherals and supports I2C, SPI, USI connectivity.

Median Price

$1.637

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 337 parts In-Stock

1+ parts

$1.798

100+ parts

$1.383

1k+ parts

$0.728

10k+ parts

-

337

$1.798

$1.383

$0.728

-

Rochester

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.310

10k+ parts

$1.170

360

-

$1.580

$1.310

$1.170

DigiKey

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.980

10k+ parts

-

360

-

-

$1.980

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Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.637

10k+ parts

$1.462

360

-

-

$1.637

$1.462

Arrow

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.024

1k+ parts

$0.868

10k+ parts

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120

-

$1.024

$0.868

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,220 parts In-Stock

1+ parts

$1.045

100+ parts

-

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1,220

$1.045

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Bristol Electronics

USA . 199 parts In-Stock

1+ parts

$2.520

100+ parts

$1.562

1k+ parts

$1.260

10k+ parts

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199

$2.520

$1.562

$1.260

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Vyrian

USA . 5,228 parts In-Stock

1+ parts

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5,228

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DigiKey Marketplace

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

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360

-

$1.050

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ACDS - Activité Composants Distribution Service

France . 199 parts In-Stock

1+ parts

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199

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Dan-Mar Components

USA . 199 parts In-Stock

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199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,109 parts In-Stock

1+ parts

$0.990

100+ parts

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2,109

$0.990

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Component Stockers USA

USA . 631 parts In-Stock

1+ parts

$1.020

100+ parts

$0.960

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631

$1.020

$0.960

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Parana Technologies

USA . 1,039 parts In-Stock

1+ parts

$68.371

100+ parts

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1,039

$68.371

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ChromeModa Solutions

Germany . 2,413 parts In-Stock

1+ parts

$76.821

100+ parts

$62.993

1k+ parts

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2,413

$76.821

$62.993

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IDEA Electronic Components Group

UK . 2,315 parts In-Stock

1+ parts

$76.821

100+ parts

$72.980

1k+ parts

$69.139

10k+ parts

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2,315

$76.821

$72.980

$69.139

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Microchip USA

USA . 9,442 parts In-Stock

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9,442

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QUARKTWIN TECHNOLOGY LTD

USA . 4,668 parts In-Stock

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4,668

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DigiPath Technology Company

USA . 463 parts In-Stock

1+ parts

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100+ parts

$69.262

1k+ parts

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10k+ parts

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463

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$69.262

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2102IN20 microcontroller. Designed with cutting-edge technology and precision engineering, this versatile device offers unparalleled performance for a wide range of applications. From smart home devices to industrial automation systems, the MSP430G2102IN20 delivers reliability, efficiency, and flexibility. With its low power consumption and high-speed processing capabilities, this microcontroller is the ideal solution for your next project. Experience the quality and value that Texas Instruments brings to every product, and take your design to the next level with the MSP430G2102IN20.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronics for its durability and resistance to heat and chemicals, making the product reliable for long-term use.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for flexibility in different power source scenarios, ensuring stable operation even with varying input voltages.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for more efficient data processing and storage, improving the overall performance of the microcontroller.

Minimum Supply Voltage: 1.8 V

The lower minimum supply voltage ensures that the microcontroller can operate in low power scenarios, making it suitable for battery-powered applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable faster data transfers between peripherals and memory without CPU intervention, improving overall system efficiency.

ROM Words: 1024

The large ROM capacity allows for storing a significant amount of program data, making the microcontroller suitable for complex applications requiring extensive programming.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, it offers high performance and efficiency in executing instructions, making it a good choice for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

No. of Timers: 4

Having multiple timers allows for precise timing control in various functions and tasks, enhancing the microcontroller's capabilities in time-sensitive applications.

Connectivity: I2C, SPI, USI

Support for multiple communication interfaces like I2C, SPI, and USI enables seamless connectivity with a wide range of external devices and peripherals, enhancing the product's versatility.

Technical Specifications

Microcontrollers MSP430G2102IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

24.33 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.35 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Trade Compliance

MSP430G2102IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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