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MSP430G2001IRSAQ1

Texas Instruments

MSP430G2001IRSAQ1 by Texas Instruments

MSP430G2001IRSAQ1 by Texas Instruments is a 16-bit microcontroller with 512 ROM words and 128 RAM bytes. Operating at up to 0.05 MHz, it's ideal for industrial applications requiring low power consumption and high reliability. With a max supply voltage of 3.6 V, this CMOS technology-based chip offers PWM channels and 10 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,611 parts In-Stock

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Digiode

USA . 4,129 parts In-Stock

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4,129

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Distributors (Availability)

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AZTECH Wire

Italy . 584 parts In-Stock

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$7.772

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$7.772

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One Stop Electronics

USA . 1,512 parts In-Stock

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$24.000

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$24.000

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Parana Technologies

USA . 1,295 parts In-Stock

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$32.128

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$2,983.582

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$28.915

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1,295

$32.128

$2,983.582

$28.915

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$35.377

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ChromeModa Solutions

Germany . 5,423 parts In-Stock

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$36.099

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$29.601

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$36.099

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IDEA Electronic Components Group

UK . 1,395 parts In-Stock

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$36.099

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$34.294

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$32.489

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$36.099

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Microchip USA

USA . 2,132 parts In-Stock

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Corphita

USA . 1,435 parts In-Stock

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Overview

Texas Instruments brings you the MSP430G2001IRSAQ1 microcontroller, a high-quality solution for various applications. This innovative product offers customers unmatched value with its reliability, efficiency, and advanced features. Whether you're looking to enhance your industrial automation, consumer electronics, or automotive design, this powerful microcontroller has got you covered. Trust Texas Instruments to deliver top-notch performance and cutting-edge technology in every product they offer. Upgrade your projects today with the MSP430G2001IRSAQ1 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and space during assembly.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options, making the product versatile for different system requirements.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, making the product suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making the product ideal for compact designs.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities and performance, making the product suitable for demanding applications.

Power Supplies (V): 2/3.3

Support for dual power supply voltages offers flexibility in system design and power management, catering to diverse application needs.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with external components and peripherals, enhancing the product's versatility.

ROM Words: 512

With 512 ROM words, the product offers ample storage capacity for program code and data, enabling the implementation of complex algorithms and functions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function reliably in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Microcontrollers MSP430G2001IRSAQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

10

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

512

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2001IRSAQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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