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MSP430G2001IPW4Q1

Texas Instruments

MSP430G2001IPW4Q1 by Texas Instruments

MSP430G2001IPW4Q1 by Texas Instruments is a 16-bit microcontroller with 512 ROM words and 128 RAM bytes. Operating at a max clock frequency of 0.05 MHz, it is suitable for industrial applications requiring low power consumption and PWM functionality. With a package style of small outline, thin profile, shrink pitch, this MCU offers dual terminal position and nickel palladium gold finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,072 parts In-Stock

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4,072

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Digiode

USA . 2,906 parts In-Stock

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2,906

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Distributors (Availability)

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One Stop Electronics

USA . 516 parts In-Stock

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$11.000

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516

$11.000

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AZTECH Wire

Italy . 762 parts In-Stock

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$16.999

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762

$16.999

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Parana Technologies

USA . 1,575 parts In-Stock

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$40.419

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$40.419

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DigiPath Technology Company

USA . 1,682 parts In-Stock

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$44.507

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1,682

$44.507

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ChromeModa Solutions

Germany . 3,586 parts In-Stock

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$45.415

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$37.240

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3,586

$45.415

$37.240

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IDEA Electronic Components Group

UK . 870 parts In-Stock

1+ parts

$45.415

100+ parts

$43.144

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$40.874

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870

$45.415

$43.144

$40.874

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Corphita

USA . 2,604 parts In-Stock

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Microchip USA

USA . 2,233 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430G2001IPW4Q1 Microcontroller. Manufactured by a trusted industry leader, this compact device offers unparalleled quality and reliability for a wide range of applications. With its advanced technology and versatile features, this microcontroller provides customers with exceptional value, efficiency, and performance. Whether you're working on automotive, industrial, or consumer electronics projects, the MSP430G2001IPW4Q1 is the perfect solution to bring your ideas to life. Elevate your designs and experience the difference with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good thermal and electrical insulation properties, making the microcontroller more reliable.

Surface Mount: YES

Ease of mounting and assembly in modern electronics manufacturing processes.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options without risking damage to the device.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Package Shape: RECTANGULAR

Efficient use of PCB space and ease of integration into existing designs.

Bit Size: 16

Offers a good balance between performance and power efficiency for various applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options for versatility in different systems.

No. of Terminals: 14

Adequate number of terminals for connecting peripherals and interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design for space-constrained applications and enhanced thermal management.

Minimum Supply Voltage: 3.3 V

Ensures stable operation at lower supply voltages, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature variations.

CPU Family: MSP430

From a reputable CPU family known for low-power consumption and high performance.

Minimum Operating Temperature: -40 °C

Capable of reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and solderability for long-term reliability.

Terminal Position: DUAL

Enhanced connectivity and signal integrity for robust system performance.

ROM Words: 512

Adequate memory capacity for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low-profile design for compact and slim device form factors.

Width: 4.4 mm

Compact width for space-efficient PCB layout and design.

Maximum Clock Frequency: 0.05 MHz

Balanced clock frequency for efficient processing without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder joints during assembly processes.

Peak Reflow Temperature °C: 260

Suitable peak temperature for reflow soldering without damaging the device.

Length: 5 mm

Optimal length for space-efficient PCB design and integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for a wide range of applications.

RAM Bytes: 128

Adequate RAM capacity for temporary data storage and efficient processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and enhanced mechanical strength.

Maximum Supply Current: 0.37 mA

Low supply current for energy-efficient operation and extended battery life.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM for easy and fast programming of firmware and updates.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for reliable connections and ease of PCB layout.

Speed: 16 rpm

Capable of fast processing speeds for real-time applications.

No. of I/O Lines: 10

Sufficient I/O lines for connecting external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers MSP430G2001IPW4Q1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

512

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2001IPW4Q1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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