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MSP430FR69891IPNR

Texas Instruments

MSP430FR69891IPNR by Texas Instruments

MSP430FR69891IPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 24 MHz clock frequency, and 63 I/O lines. Ideal for industrial applications requiring low power consumption and high performance. Features ADC and DMA channels for efficient data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,506 parts In-Stock

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Vyrian

USA . 2,075 parts In-Stock

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2,075

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Distributors (Availability)

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AZTECH Wire

Italy . 690 parts In-Stock

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$6.226

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690

$6.226

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One Stop Electronics

USA . 1,072 parts In-Stock

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$13.000

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1,072

$13.000

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Microchip USA

USA . 332 parts In-Stock

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$29.260

100+ parts

$29.080

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$28.990

10k+ parts

$28.900

332

$29.260

$29.080

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$28.900

Parana Technologies

USA . 307 parts In-Stock

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$48.641

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307

$48.641

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DigiPath Technology Company

USA . 1,637 parts In-Stock

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$53.560

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$49.275

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1,637

$53.560

$49.275

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ChromeModa Solutions

Germany . 3,493 parts In-Stock

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$54.653

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$44.815

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3,493

$54.653

$44.815

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IDEA Electronic Components Group

UK . 967 parts In-Stock

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$54.653

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$51.920

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$49.188

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967

$54.653

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Component Stockers USA

USA . 794 parts In-Stock

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$99.990

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Corphita

USA . 480 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the MSP430FR69891IPNR by Texas Instruments. Crafted with precision and expertise, this microcontroller redefines innovation in the realm of electronics. With applications ranging from IoT devices to industrial automation, this product offers unmatched value and versatility. Experience seamless integration, enhanced functionality, and reliable performance that cater to your unique needs. Elevate your projects with the quality and advantages of Texas Instruments, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packages are lightweight, cost-effective, and offer good thermal properties, making this microcontroller easy to handle and suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving space and enhancing the overall design flexibility.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage of 3.6V provides flexibility in powering the microcontroller and allows for compatibility with various voltage sources.

Package Shape: SQUARE

Square packages are efficient in terms of space utilization and provide a stable mounting platform for the microcontroller, enhancing reliability in different applications.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for higher precision and processing capabilities, making it suitable for tasks that require complex calculations and data manipulation.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for interfacing with external devices, sensors, and peripherals, making this microcontroller versatile and adaptable to different system requirements.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement of 1.8V allows for energy-efficient operation and enables the microcontroller to function in low-power applications without compromising performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high-temperature environments and ensures reliable performance in various industrial settings.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 85°C ensures that the microcontroller can operate in extreme cold or hot conditions, making it suitable for applications in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish offers excellent corrosion resistance and ensures reliable electrical connections, prolonging the lifespan of the microcontroller and enhancing overall performance.

Technical Specifications

Microcontrollers MSP430FR69891IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

63

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430FR69891IPNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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