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MSP430FR6988IPN

Texas Instruments

MSP430FR6988IPN by Texas Instruments

MSP430FR6988IPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at max 24 MHz. It features 12 ADC channels, 3 DMA channels, and peripherals like BOD, CRC, and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.128

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,077 parts In-Stock

1+ parts

$7.128

100+ parts

$5.811

1k+ parts

$3.874

10k+ parts

-

4,077

$7.128

$5.811

$3.874

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,801 parts In-Stock

1+ parts

$6.772

100+ parts

-

1k+ parts

-

10k+ parts

-

4,801

$6.772

-

-

-

Vyrian

USA . 3,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,070 parts In-Stock

1+ parts

$6.415

100+ parts

-

1k+ parts

-

10k+ parts

-

4,070

$6.415

-

-

-

AZTECH Wire

Italy . 1,167 parts In-Stock

1+ parts

$19.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,167

$19.850

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-

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Parana Technologies

USA . 14 parts In-Stock

1+ parts

$69.384

100+ parts

$6,443.394

1k+ parts

$62.446

10k+ parts

-

14

$69.384

$6,443.394

$62.446

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DigiPath Technology Company

USA . 2,276 parts In-Stock

1+ parts

$76.401

100+ parts

$70.289

1k+ parts

-

10k+ parts

-

2,276

$76.401

$70.289

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-

ChromeModa Solutions

Germany . 1,014 parts In-Stock

1+ parts

$77.960

100+ parts

$63.927

1k+ parts

-

10k+ parts

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1,014

$77.960

$63.927

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IDEA Electronic Components Group

UK . 421 parts In-Stock

1+ parts

$77.960

100+ parts

$74.062

1k+ parts

$70.164

10k+ parts

-

421

$77.960

$74.062

$70.164

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR6988IPN microcontroller. Built with precision and reliability in mind, this versatile device offers a wide range of applications for your projects. From industrial automation to consumer electronics, the MSP430FR6988IPN delivers unparalleled performance and efficiency. With its advanced features and low power consumption, this microcontroller is the perfect choice for those looking to take their designs to the next level. Trust Texas Instruments to provide you with the quality and value you need to succeed. Elevate your creations with the MSP430FR6988IPN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

The ability to operate at a maximum supply voltage of 3.6V allows for flexibility in power supply options and compatibility with a wide range of systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and streamlined processing, enabling faster execution of instructions and overall improved performance.

ROM Programmability: FLASH

Flash programmability for the ROM allows for easy and quick updates to the program memory, enhancing flexibility and ease of use for programming.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, expanding the range of input signals that can be processed by the microcontroller.

PWM Channels: YES

PWM channels support pulse-width modulation, a key feature for controlling power output and motor speed in various applications like robotics and automation.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI(2)

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USCI enhance communication capabilities and compatibility with various communication protocols.

Speed: 16 rpm

With a speed of 16 rpm, the microcontroller can efficiently process tasks at a moderate pace suitable for a wide range of applications.

Low Power Mode: YES

The availability of low power mode allows for energy-efficient operation, prolonging battery life and enabling power-saving applications.

Technical Specifications

Microcontrollers MSP430FR6988IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6988IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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