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MSP430FR6987IPZR

Texas Instruments

MSP430FR6987IPZR by Texas Instruments

MSP430FR6987IPZR by Texas Instruments is a 16-bit microcontroller with 83 I/O lines, 65536 ROM words, and 24 MHz clock frequency. Ideal for industrial applications requiring low power consumption and high performance in a compact package. Features ADC and DMA channels for efficient data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,659 parts In-Stock

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7,659

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Digiode

USA . 2,003 parts In-Stock

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2,003

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Distributors (Availability)

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$12.600

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867

$12.600

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Parana Technologies

USA . 2,233 parts In-Stock

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$18.192

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$18.330

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2,233

$18.192

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$18.330

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DigiPath Technology Company

USA . 1,171 parts In-Stock

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$20.032

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$18.430

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$20.032

$18.430

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ChromeModa Solutions

Germany . 6,608 parts In-Stock

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$20.441

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$16.762

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$20.441

$16.762

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IDEA Electronic Components Group

UK . 534 parts In-Stock

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$20.441

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$19.419

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$18.397

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534

$20.441

$19.419

$18.397

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Microchip USA

USA . 336 parts In-Stock

1+ parts

$26.070

100+ parts

$25.910

1k+ parts

$25.830

10k+ parts

$25.750

336

$26.070

$25.910

$25.830

$25.750

One Stop Electronics

USA . 658 parts In-Stock

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$34.000

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658

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Component Stockers USA

USA . 498 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,458 parts In-Stock

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Corphita

USA . 285 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR6987IPZR microcontroller, a game-changer in the world of technology. Designed with precision and expertise by Texas Instruments, this microcontroller boasts unparalleled quality and reliability. From industrial applications to consumer electronics, this powerful device offers efficiency, flexibility, and unmatched performance. Experience seamless integration, advanced features, and cutting-edge technology with the MSP430FR6987IPZR. Elevate your projects and transform your ideas into reality with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product suitable for portable applications.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, increasing compatibility with various power sources.

Package Shape: SQUARE

Square packages are space-efficient and easy to handle during assembly.

Bit Size: 16

16-bit processing allows for improved computational capability and data manipulation.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers thermal efficiency, low profile design, and fine pitch for high-density mounting.

Minimum Supply Voltage: 1.8 V

Supports a low supply voltage, enabling energy-efficient operation and extending battery life.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function in extreme cold temperatures without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, expanding the range of applications for the product.

DMA Channels: YES

Direct memory access channels improve data transfer speed and efficiency, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection during installation and operation.

ROM Words: 65536

Large ROM capacity allows for storing and executing complex programs and data efficiently.

Maximum Seated Height: 1.6 mm

Low seated height enables slim and compact designs, ideal for space-constrained applications.

Width: 14 mm

Moderate width offers a good balance between space efficiency and handling during assembly.

Maximum Clock Frequency: 24 MHz

High clock frequency supports fast processing speed, ideal for real-time applications and quick data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and robust PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints and durable connections.

Length: 14 mm

Moderate length offers a good balance between space efficiency and component placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in microcontroller design offers efficient instruction execution and faster processing speeds.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering connections and ease of handling during assembly.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and compatibility with a standard power source.

PWM Channels: YES

Pulse-width modulation channels offer precise control over output signals, vital for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides high-density mounting options, saving PCB space and enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate moisture sensitivity, suitable for standard PCB handling and storage conditions.

Speed: 16 rpm

Operating at 16 revolutions per minute indicates a moderate processing speed for general-purpose applications.

No. of I/O Lines: 83

High number of I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR6987IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430FR6987IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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