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MSP430FR6979IPZ

Texas Instruments

MSP430FR6979IPZ by Texas Instruments

MSP430FR6979IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 16-channel ADC, DMA support, and multiple peripherals, it offers versatile connectivity options for various embedded systems.

Median Price

$6.357

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,770 parts In-Stock

1+ parts

$6.357

100+ parts

$5.183

1k+ parts

$3.455

10k+ parts

-

1,770

$6.357

$5.183

$3.455

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,920 parts In-Stock

1+ parts

$6.039

100+ parts

-

1k+ parts

-

10k+ parts

-

4,920

$6.039

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.420

100+ parts

-

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-

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10

$6.420

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-

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Vyrian

USA . 2,784 parts In-Stock

1+ parts

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2,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,680 parts In-Stock

1+ parts

$5.400

100+ parts

$5.265

1k+ parts

$5.238

10k+ parts

-

1,680

$5.400

$5.265

$5.238

-

Ampacity Inc.

Singapore . 1,602 parts In-Stock

1+ parts

$5.400

100+ parts

-

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1,602

$5.400

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Corphita

USA . 2,169 parts In-Stock

1+ parts

$5.721

100+ parts

-

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2,169

$5.721

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-

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$6.420

100+ parts

$6.099

1k+ parts

$5.794

10k+ parts

$5.714

200

$6.420

$6.099

$5.794

$5.714

Corohmni

South Africa . 148 parts In-Stock

1+ parts

$6.420

100+ parts

-

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148

$6.420

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Continental Prestige Electronics

USA . 3,006 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

$6.292

3,006

$6.420

-

-

$6.292

AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$11.680

100+ parts

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866

$11.680

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Parana Technologies

USA . 549 parts In-Stock

1+ parts

$54.162

100+ parts

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549

$54.162

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DigiPath Technology Company

USA . 2,119 parts In-Stock

1+ parts

$59.639

100+ parts

$54.868

1k+ parts

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10k+ parts

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2,119

$59.639

$54.868

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ChromeModa Solutions

Germany . 1,014 parts In-Stock

1+ parts

$60.856

100+ parts

$49.902

1k+ parts

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1,014

$60.856

$49.902

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IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$60.856

100+ parts

$57.813

1k+ parts

$54.770

10k+ parts

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569

$60.856

$57.813

$54.770

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Argo Parts USA

USA . 3,162 parts In-Stock

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3,162

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Overview

Unlock endless possibilities with the MSP430FR6979IPZ microcontroller by Texas Instruments. Designed with cutting-edge technology, this versatile device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value with its low power consumption, high-speed processing, and innovative features. Trust in Texas Instruments' renowned quality and experience seamless integration with the MSP430FR6979IPZ for all your project needs. Elevate your designs with the ultimate solution in microcontroller technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, suitable for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources and ensures stable operation.

Bit Size: 16

16-bit architecture provides sufficient processing power for handling complex tasks efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures high performance with simplified instruction sets, making it ideal for embedded applications.

RAM Bytes: 2048

Ample RAM size allows for storing and manipulating data efficiently, enabling smooth performance of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with 12-bit resolution enable accurate and precise analog signal conversion.

PWM Channels: YES

Pulse Width Modulation (PWM) capability allows for control of analog devices such as motors, LEDs, and servos with high precision.

Connectivity: EUSCI(4)

EUSCI modules provide flexible and versatile communication interfaces, enhancing the connectivity options of the microcontroller.

Low Power Mode: YES

Support for low power modes extends battery life and reduces power consumption, making it suitable for energy-efficient designs.

Technical Specifications

Microcontrollers MSP430FR6979IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6979IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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