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MSP430FR69791IPZR

Texas Instruments

MSP430FR69791IPZR by Texas Instruments

MSP430FR69791IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 16 ADC channels, 3 DMA channels, and connectivity via EUSCI(4), it's ideal for embedded systems in various industries.

Median Price

$3.785

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.785

100+ parts

-

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500

$3.785

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Vyrian

USA . 7,896 parts In-Stock

1+ parts

-

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7,896

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Digiode

USA . 3,041 parts In-Stock

1+ parts

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3,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,940 parts In-Stock

1+ parts

$3.785

100+ parts

-

1k+ parts

-

10k+ parts

$3.709

3,940

$3.785

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-

$3.709

Argo Parts USA

USA . 2,104 parts In-Stock

1+ parts

$3.785

100+ parts

-

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2,104

$3.785

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Corohmni

South Africa . 685 parts In-Stock

1+ parts

$3.785

100+ parts

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685

$3.785

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One Stop Electronics

USA . 1,254 parts In-Stock

1+ parts

$9.000

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1,254

$9.000

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Ampacity Inc.

Singapore . 629 parts In-Stock

1+ parts

$15.000

100+ parts

-

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629

$15.000

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$15.234

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630

$15.234

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Semicontronic

India . 360 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

-

360

$19.000

$18.525

$18.430

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

$42.482

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1,017

$42.482

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DigiPath Technology Company

USA . 826 parts In-Stock

1+ parts

$46.778

100+ parts

$43.036

1k+ parts

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826

$46.778

$43.036

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ChromeModa Solutions

Germany . 6,161 parts In-Stock

1+ parts

$47.733

100+ parts

$39.141

1k+ parts

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6,161

$47.733

$39.141

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

1+ parts

$47.733

100+ parts

$45.346

1k+ parts

$42.960

10k+ parts

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1,867

$47.733

$45.346

$42.960

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Corphita

USA . 3,157 parts In-Stock

1+ parts

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3,157

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.709

1k+ parts

$3.595

10k+ parts

$3.520

1,000

-

$3.709

$3.595

$3.520

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR69791IPZR microcontroller. This cutting-edge device combines exceptional quality and reliability with a wide range of applications in various industries. With advanced features like low power mode, robust peripherals, and high-speed connectivity, this product offers unmatched value and performance to customers looking for seamless integration and efficient operation. Trust Texas Instruments to deliver superior technology that exceeds expectations and drives success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Easy to integrate into circuit boards and offers space-saving design.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers good processing power for a variety of tasks.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances space efficiency and ease of soldering during assembly.

CPU Family: MSP430

Reliable and widely recognized microcontroller family for embedded systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient operation.

Maximum Clock Frequency: 16 MHz

Provides decent processing speed for tasks requiring real-time computation.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

RAM Bytes: 2048

Adequate memory capacity for storing data and program instructions.

Technical Specifications

Microcontrollers MSP430FR69791IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR69791IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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