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MSP430FR6927IRGCT

Texas Instruments

MSP430FR6927IRGCT by Texas Instruments

MSP430FR6927IRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 8-Ch 12-Bit ADCs, FRAM ROM programmability, and low power mode, making it ideal for industrial applications requiring high-speed processing and low energy consumption.

Median Price

$4.444

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,750 parts In-Stock

1+ parts

$5.062

100+ parts

$4.436

1k+ parts

$2.506

10k+ parts

-

1,750

$5.062

$4.436

$2.506

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DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.827

10k+ parts

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250

-

-

$3.827

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,322 parts In-Stock

1+ parts

$4.809

100+ parts

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1,322

$4.809

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Vyrian

USA . 5,832 parts In-Stock

1+ parts

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5,832

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 952 parts In-Stock

1+ parts

$3.330

100+ parts

$3.247

1k+ parts

$3.230

10k+ parts

-

952

$3.330

$3.247

$3.230

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Ampacity Inc.

Singapore . 783 parts In-Stock

1+ parts

$3.330

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-

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783

$3.330

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Corohmni

South Africa . 151 parts In-Stock

1+ parts

$4.000

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151

$4.000

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Corphita

USA . 1,086 parts In-Stock

1+ parts

$4.556

100+ parts

-

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1,086

$4.556

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Microchip USA

USA . 2,384 parts In-Stock

1+ parts

$27.970

100+ parts

$27.800

1k+ parts

$27.710

10k+ parts

$27.620

2,384

$27.970

$27.800

$27.710

$27.620

Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

$41.851

100+ parts

-

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1,491

$41.851

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DigiPath Technology Company

USA . 980 parts In-Stock

1+ parts

$46.084

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980

$46.084

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IDEA Electronic Components Group

UK . 2,294 parts In-Stock

1+ parts

$47.024

100+ parts

$44.673

1k+ parts

$42.322

10k+ parts

-

2,294

$47.024

$44.673

$42.322

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ChromeModa Solutions

Germany . 56 parts In-Stock

1+ parts

$47.024

100+ parts

$38.560

1k+ parts

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56

$47.024

$38.560

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QUARKTWIN TECHNOLOGY LTD

USA . 13,696 parts In-Stock

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13,696

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Continental Prestige Electronics

USA . 4,576 parts In-Stock

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4,576

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Argo Parts USA

USA . 1,353 parts In-Stock

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1,353

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR6927IRGCT microcontroller. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance your IoT project or streamline your industrial automation system, this microcontroller is designed to meet your every need. Experience seamless connectivity, low power consumption, and top-notch speed with the MSP430FR6927IRGCT. Elevate your projects to new heights with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

CPU Family: MSP430

Being part of the MSP430 family means access to a wide range of resources, support, and community for development and troubleshooting.

ADC Channels: YES

On-board Analog to Digital Convertors make it easier to interface with analog sensors and inputs.

RAM Bytes: 2048

Sufficient RAM size for running multiple processes and applications simultaneously without running out of memory.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast operation and processing speeds, making it suitable for time-sensitive applications.

Connectivity: EUSCI(4)

Multiple communication interfaces provide flexibility in connecting to other devices and peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient processing and lower power consumption, making it suitable for low-power applications.

Technical Specifications

Microcontrollers MSP430FR6927IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6927IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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