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MSP430FR69271IPMR

Texas Instruments

MSP430FR69271IPMR by Texas Instruments

MSP430FR69271IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features FRAM ROM programmability, 8-channel ADCs, and low power modes. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.586

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,550 parts In-Stock

1+ parts

$3.586

100+ parts

$3.142

1k+ parts

$1.775

10k+ parts

-

4,550

$3.586

$3.142

$1.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,523 parts In-Stock

1+ parts

$3.407

100+ parts

-

1k+ parts

-

10k+ parts

-

2,523

$3.407

-

-

-

Vyrian

USA . 8,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,254 parts In-Stock

1+ parts

$3.227

100+ parts

-

1k+ parts

-

10k+ parts

-

2,254

$3.227

-

-

-

AZTECH Wire

Italy . 787 parts In-Stock

1+ parts

$18.480

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$18.480

-

-

-

Parana Technologies

USA . 1,816 parts In-Stock

1+ parts

$24.560

100+ parts

-

1k+ parts

$25.227

10k+ parts

-

1,816

$24.560

-

$25.227

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ChromeModa Solutions

Germany . 5,238 parts In-Stock

1+ parts

$27.596

100+ parts

$22.629

1k+ parts

-

10k+ parts

-

5,238

$27.596

$22.629

-

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IDEA Electronic Components Group

UK . 2,161 parts In-Stock

1+ parts

$27.596

100+ parts

$26.216

1k+ parts

$24.836

10k+ parts

-

2,161

$27.596

$26.216

$24.836

-

DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

-

100+ parts

$24.881

1k+ parts

-

10k+ parts

-

1,182

-

$24.881

-

-

Overview

Discover the MSP430FR69271IPMR by Texas Instruments, a high-quality microcontroller designed to meet your diverse application needs. With a range of peripherals including analog comparator, RTC, and DMA channels, this versatile device offers unparalleled flexibility and performance. Whether you're working on IoT projects, sensor applications, or industrial automation, this microcontroller delivers low power consumption, fast clock frequencies, and advanced connectivity options. Trust in Texas Instruments' reputation for excellence and unlock endless possibilities with the MSP430FR69271IPMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product suitable for portable and budget-friendly applications.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and improving overall product reliability.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of external components.

Package Shape: SQUARE

Square package shape ensures efficient use of PCB real estate, maximizing component density on the board.

Bit Size: 16

16-bit architecture provides a good balance between performance and power consumption, suitable for various embedded applications.

No. of Terminals: 64

Ample number of terminals allow for versatile connectivity options and expandability to interface with multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enhances thermal performance, reduces signal interference, and enables high-density mounting for space-constrained designs.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage enables energy-efficient operation and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

Higher maximum operating temperature ensures reliable performance in harsh environments or under intensive processing loads.

CPU Family: MSP430

MSP430 is known for its low power consumption, high integration, and ease of use, making it a popular choice for battery-powered devices.

Technical Specifications

Microcontrollers MSP430FR69271IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

ANALOG COMPARATOR, BOR, CRC, DMA, LCD, RTC, TIMER

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69271IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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