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MSP430FR6922IRGCT

Texas Instruments

MSP430FR6922IRGCT by Texas Instruments

MSP430FR6922IRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$4.594

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,000 parts In-Stock

1+ parts

$4.594

100+ parts

$3.746

1k+ parts

$2.497

10k+ parts

-

5,000

$4.594

$3.746

$2.497

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$8.930

100+ parts

$5.170

1k+ parts

$4.040

10k+ parts

-

250

$8.930

$5.170

$4.040

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.201

10k+ parts

-

250

-

-

$4.201

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,326 parts In-Stock

1+ parts

$4.364

100+ parts

-

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-

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1,326

$4.364

-

-

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Vyrian

USA . 8,194 parts In-Stock

1+ parts

-

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8,194

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

-

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-

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650

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,543 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,543

$3.000

-

-

-

Corphita

USA . 1,848 parts In-Stock

1+ parts

$4.135

100+ parts

-

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10k+ parts

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1,848

$4.135

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-

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Corohmni

South Africa . 167 parts In-Stock

1+ parts

$17.368

100+ parts

-

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167

$17.368

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-

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Microchip USA

USA . 2,268 parts In-Stock

1+ parts

$30.330

100+ parts

$30.140

1k+ parts

$30.050

10k+ parts

$29.950

2,268

$30.330

$30.140

$30.050

$29.950

Parana Technologies

USA . 968 parts In-Stock

1+ parts

$34.326

100+ parts

-

1k+ parts

$147.123

10k+ parts

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968

$34.326

-

$147.123

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DigiPath Technology Company

USA . 1,265 parts In-Stock

1+ parts

$37.798

100+ parts

$34.774

1k+ parts

-

10k+ parts

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1,265

$37.798

$34.774

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ChromeModa Solutions

Germany . 1,483 parts In-Stock

1+ parts

$38.569

100+ parts

$31.627

1k+ parts

-

10k+ parts

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1,483

$38.569

$31.627

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IDEA Electronic Components Group

UK . 259 parts In-Stock

1+ parts

$38.569

100+ parts

$36.641

1k+ parts

$34.712

10k+ parts

-

259

$38.569

$36.641

$34.712

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iodParts Technologies Inc.

India . 22,400 parts In-Stock

1+ parts

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22,400

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Argo Parts USA

USA . 3,372 parts In-Stock

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3,372

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Continental Prestige Electronics

USA . 1,163 parts In-Stock

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1,163

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

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100

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR6922IRGCT microcontroller. With a reputation for excellence and innovation, Texas Instruments delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its low power consumption, advanced peripherals, and high-speed performance. Experience the benefits of cutting-edge technology and seamless connectivity with the MSP430FR6922IRGCT, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage : 3.6 V

Allows for flexibility in power supply options.

Bit Size : 16

Offers a good balance between complexity and performance for a microcontroller.

No. of Terminals : 64

Provides ample connectivity options for various peripherals.

Peripheral IC Type : MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and performance.

ADC Channels : YES

Enables analog to digital conversion capabilities for sensor integration.

ROM Words : 65536

Sufficient programmable memory for storing instructions and data.

Speed : 16 rpm

High clock frequency for fast data processing.

Connectivity : IRDA, I2C, SPI(2), UART

Offers various communication interfaces for diverse connectivity options.

RAM Bytes : 2048

Adequate random access memory for data storage and manipulation.

Technical Specifications

Microcontrollers MSP430FR6922IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6922IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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