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MSP430FR6922IG56R

Texas Instruments

MSP430FR6922IG56R by Texas Instruments

MSP430FR6922IG56R by Texas Instruments is a 16-bit microcontroller with 52 I/O lines, 8-Ch 12-Bit ADC channels, and FRAM ROM programmability. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and low power mode support. Offers various peripherals like BOR, CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT for versatile connectivity via IRDA, I2C, SPI(2), UART interfaces.

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,232 parts In-Stock

1+ parts

$3.798

100+ parts

$3.096

1k+ parts

$2.064

10k+ parts

-

19,232

$3.798

$3.096

$2.064

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,309 parts In-Stock

1+ parts

$3.608

100+ parts

-

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-

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1,309

$3.608

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Vyrian

USA . 8,564 parts In-Stock

1+ parts

-

100+ parts

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8,564

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-

-

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Chip Stock

USA . 3,700 parts In-Stock

1+ parts

-

100+ parts

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3,700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,048 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

-

10k+ parts

-

1,048

$3.418

-

-

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AZTECH Wire

Italy . 1,091 parts In-Stock

1+ parts

$17.880

100+ parts

-

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1,091

$17.880

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Microchip USA

USA . 1,368 parts In-Stock

1+ parts

$18.020

100+ parts

$17.910

1k+ parts

$17.860

10k+ parts

$17.800

1,368

$18.020

$17.910

$17.860

$17.800

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$28.793

100+ parts

$26.202

1k+ parts

$23.610

10k+ parts

-

300

$28.793

$26.202

$23.610

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Parana Technologies

USA . 2,378 parts In-Stock

1+ parts

$34.150

100+ parts

-

1k+ parts

$143.352

10k+ parts

-

2,378

$34.150

-

$143.352

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$37.604

100+ parts

-

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836

$37.604

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ChromeModa Solutions

Germany . 5,303 parts In-Stock

1+ parts

$38.371

100+ parts

$31.464

1k+ parts

-

10k+ parts

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5,303

$38.371

$31.464

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$38.371

100+ parts

$36.452

1k+ parts

$34.534

10k+ parts

-

1,668

$38.371

$36.452

$34.534

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QUARKTWIN TECHNOLOGY LTD

USA . 3,603 parts In-Stock

1+ parts

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3,603

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Metaverse IC Inc.

Canada . 588 parts In-Stock

1+ parts

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588

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Overview

Unlock the potential of your next project with the MSP430FR6922IG56R by Texas Instruments. This innovative microcontroller combines cutting-edge technology with the renowned quality of Texas Instruments, offering a reliable solution for a wide range of applications. From industrial automation to smart home devices, this compact and versatile device delivers exceptional performance while consuming minimal power. Trust in Texas Instruments to bring value and efficiency to your designs with the MSP430FR6922IG56R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while maintaining stable performance.

Package Shape: RECTANGULAR

Easily fits into standard packaging and board layouts for integration into various applications.

Bit Size: 16

Offers a good balance between processing power and energy efficiency for a wide range of tasks.

No. of Terminals: 56

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-efficient designs, ideal for applications with limited board space.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions, suitable for industrial applications.

CPU Family: MSP430

Known for its low-power consumption and high-performance capabilities, making it a popular choice for embedded systems.

Technical Specifications

Microcontrollers MSP430FR6922IG56R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6922IG56R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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