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MSP430FR69221IRGCT

Texas Instruments

MSP430FR69221IRGCT by Texas Instruments

Texas Instruments' MSP430FR69221IRGCT is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. Featuring FRAM ROM programmability and low power mode, it offers 8 ADC channels and 3 DMA channels for applications like industrial automation and IoT devices.

Median Price

$4.048

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,250 parts In-Stock

1+ parts

$4.594

100+ parts

$3.746

1k+ parts

$2.497

10k+ parts

-

12,250

$4.594

$3.746

$2.497

-

DigiKey

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.503

10k+ parts

$3.442

1,250

-

-

$3.503

$3.442

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 898 parts In-Stock

1+ parts

$4.364

100+ parts

-

1k+ parts

-

10k+ parts

-

898

$4.364

-

-

-

Vyrian

USA . 1,922 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,922

-

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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500

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,646 parts In-Stock

1+ parts

$3.560

100+ parts

-

1k+ parts

-

10k+ parts

-

6,646

$3.560

-

-

-

Corphita

USA . 3,252 parts In-Stock

1+ parts

$4.135

100+ parts

-

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-

10k+ parts

-

3,252

$4.135

-

-

-

Microchip USA

USA . 2,635 parts In-Stock

1+ parts

$30.330

100+ parts

$30.140

1k+ parts

$30.050

10k+ parts

$29.950

2,635

$30.330

$30.140

$30.050

$29.950

Corohmni

South Africa . 791 parts In-Stock

1+ parts

$39.204

100+ parts

-

1k+ parts

-

10k+ parts

-

791

$39.204

-

-

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Parana Technologies

USA . 149 parts In-Stock

1+ parts

$58.398

100+ parts

-

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149

$58.398

-

-

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DigiPath Technology Company

USA . 623 parts In-Stock

1+ parts

$64.304

100+ parts

$59.159

1k+ parts

-

10k+ parts

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623

$64.304

$59.159

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-

ChromeModa Solutions

Germany . 5,713 parts In-Stock

1+ parts

$65.616

100+ parts

$53.805

1k+ parts

-

10k+ parts

-

5,713

$65.616

$53.805

-

-

IDEA Electronic Components Group

UK . 1,490 parts In-Stock

1+ parts

$65.616

100+ parts

$62.335

1k+ parts

$59.054

10k+ parts

-

1,490

$65.616

$62.335

$59.054

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Argo Parts USA

USA . 4,753 parts In-Stock

1+ parts

-

100+ parts

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4,753

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Continental Prestige Electronics

USA . 2,332 parts In-Stock

1+ parts

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2,332

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unleash the power of innovation with the MSP430FR69221IRGCT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. This microcontroller offers unmatched value with features like low power mode, FRAM ROM programmability, and an array of peripherals including BOR, CRC, RTC, and more. Whether you're designing IoT devices, wearable technology, or smart home systems, this chip will take your project to the next level. Trust Texas Instruments for superior performance and reliability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more flexibility in power requirements and can support a wider range of external components.

Bit Size: 16

16-bit architecture offers improved processing capabilities and performance compared to lower bit sizes.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and interfaces with other devices or peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture typically offers faster and more efficient processing, making it a good choice for embedded systems.

RAM Bytes: 2048

Having a decent amount of RAM allows for efficient data processing and storage, supporting complex algorithms and applications.

ADC Channels: YES

Built-in ADC (Analog-to-Digital Converter) channels enable the microcontroller to interface with analog sensors or signals, expanding its capabilities.

DMA Channels: YES

DMA (Direct Memory Access) channels help in offloading data transfer tasks from the CPU, improving overall system performance and efficiency.

Connectivity: IRDA, I2C, SPI(2), UART

Support for multiple communication protocols like IRDA, I2C, SPI, and UART allows for flexible interfacing with various external devices or networks.

Technical Specifications

Microcontrollers MSP430FR69221IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69221IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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