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MSP430FR69221IG56R

Texas Instruments

MSP430FR69221IG56R by Texas Instruments

MSP430FR69221IG56R by Texas Instruments is a 16-bit microcontroller with 52 I/O lines, 8 ADC channels, and 3 DMA channels. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. With FRAM ROM programmability and various peripherals like RTC and PWM, it offers versatile connectivity options including IRDA, I2C, SPI, and UART.

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.798

100+ parts

$3.096

1k+ parts

$2.064

10k+ parts

-

3,950

$3.798

$3.096

$2.064

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,653 parts In-Stock

1+ parts

$3.608

100+ parts

-

1k+ parts

-

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2,653

$3.608

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Vyrian

USA . 6,043 parts In-Stock

1+ parts

-

100+ parts

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6,043

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,678 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

-

10k+ parts

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1,678

$3.418

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AZTECH Wire

Italy . 1,065 parts In-Stock

1+ parts

$13.340

100+ parts

-

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1,065

$13.340

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Microchip USA

USA . 3,058 parts In-Stock

1+ parts

$18.782

100+ parts

-

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3,058

$18.782

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Parana Technologies

USA . 527 parts In-Stock

1+ parts

$19.819

100+ parts

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1k+ parts

$19.777

10k+ parts

-

527

$19.819

-

$19.777

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DigiPath Technology Company

USA . 218 parts In-Stock

1+ parts

$21.823

100+ parts

$20.077

1k+ parts

-

10k+ parts

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218

$21.823

$20.077

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ChromeModa Solutions

Germany . 5,209 parts In-Stock

1+ parts

$22.268

100+ parts

$18.260

1k+ parts

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5,209

$22.268

$18.260

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

1+ parts

$22.268

100+ parts

$21.155

1k+ parts

$20.041

10k+ parts

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1,454

$22.268

$21.155

$20.041

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR69221IG56R microcontroller. Built with precision and expertise, this device is perfect for a wide range of applications in various industries. From industrial automation to consumer electronics, the possibilities are endless. Experience unparalleled performance and reliability with the MSP430FR69221IG56R, providing customers with value, efficiency, and cutting-edge technology. Upgrade your projects today with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Minimum Supply Voltage: 1.8 V

Offers energy efficiency and the ability to operate in low power settings.

CPU Family: MSP430

MSP430 is known for its low power consumption and high performance, making it a reliable choice for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing of instructions, making the microcontroller faster and more responsive.

RAM Bytes: 2048

Sufficient memory for storing and processing data, enabling complex operations and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Analog To Digital Convertors: 8-Ch 12-Bit

Provides accurate conversion of analog signals to digital data, essential for interfacing with sensors and other analog devices.

Connectivity: IRDA, I2C, SPI(2), UART

Offers a variety of communication interfaces for connecting with other devices, expanding the versatility of the microcontroller.

No. of I/O Lines: 52

Plenty of input/output lines for connecting to external components and peripherals, allowing for versatile integration in various systems.

Technical Specifications

Microcontrollers MSP430FR69221IG56R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69221IG56R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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