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MSP430FR6889IPZR

Texas Instruments

MSP430FR6889IPZR by Texas Instruments

MSP430FR6889IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and various peripherals like LCD, RTC, and timers. With a max clock frequency of 24 MHz, it offers efficient performance in compact dimensions (14mm x 14mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,794 parts In-Stock

1+ parts

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7,794

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Digiode

USA . 2,428 parts In-Stock

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2,428

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,772 parts In-Stock

1+ parts

$14.451

100+ parts

-

1k+ parts

$14.894

10k+ parts

-

1,772

$14.451

-

$14.894

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DigiPath Technology Company

USA . 775 parts In-Stock

1+ parts

$15.912

100+ parts

-

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775

$15.912

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ChromeModa Solutions

Germany . 2,099 parts In-Stock

1+ parts

$16.237

100+ parts

$13.314

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-

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2,099

$16.237

$13.314

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IDEA Electronic Components Group

UK . 88 parts In-Stock

1+ parts

$16.237

100+ parts

$15.425

1k+ parts

$14.613

10k+ parts

-

88

$16.237

$15.425

$14.613

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$18.494

100+ parts

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482

$18.494

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Microchip USA

USA . 356 parts In-Stock

1+ parts

$26.800

100+ parts

$26.640

1k+ parts

$26.550

10k+ parts

$26.470

356

$26.800

$26.640

$26.550

$26.470

One Stop Electronics

USA . 436 parts In-Stock

1+ parts

$29.000

100+ parts

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436

$29.000

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Corphita

USA . 3,850 parts In-Stock

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3,850

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430FR6889IPZR microcontroller. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a game-changing product that offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this microcontroller is designed to optimize performance and efficiency. Experience seamless connectivity, advanced peripherals, and innovative features that will elevate your projects to new heights. Choose the MSP430FR6889IPZR and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while maintaining safe operation.

Bit Size: 16

Offers a good balance between processing power and complexity for various applications.

ADC Channels: YES

Enables analog to digital conversion, essential for reading sensor data and interfacing with the external world.

Maximum Clock Frequency: 24 MHz

Provides high-speed processing capabilities for quick and responsive operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

RAM Bytes: 2048

Sufficient memory for storing data and program instructions, supporting complex algorithms and tasks.

ROM Programmability: FRAM

FRAM technology allows for fast and reliable programming of read-only memory, enhancing flexibility and performance.

Connectivity: EUSCI(4)

Supports versatile communication interfaces for connecting to other devices and systems.

Technical Specifications

Microcontrollers MSP430FR6889IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6889IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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