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MSP430FR68891IPZ

Texas Instruments

MSP430FR68891IPZ by Texas Instruments

MSP430FR68891IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It features 16 ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.299

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,170 parts In-Stock

1+ parts

$7.299

100+ parts

$5.951

1k+ parts

$3.967

10k+ parts

-

3,170

$7.299

$5.951

$3.967

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,702 parts In-Stock

1+ parts

$6.934

100+ parts

-

1k+ parts

-

10k+ parts

-

3,702

$6.934

-

-

-

Vyrian

USA . 3,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,180 parts In-Stock

1+ parts

$6.569

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$6.569

-

-

-

AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$14.750

100+ parts

-

1k+ parts

-

10k+ parts

-

404

$14.750

-

-

-

Microchip USA

USA . 2,994 parts In-Stock

1+ parts

$19.970

100+ parts

$19.680

1k+ parts

$19.540

10k+ parts

$19.400

2,994

$19.970

$19.680

$19.540

$19.400

Parana Technologies

USA . 2,215 parts In-Stock

1+ parts

$52.158

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

$52.158

-

-

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DigiPath Technology Company

USA . 1,115 parts In-Stock

1+ parts

$57.432

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

$57.432

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-

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ChromeModa Solutions

Germany . 3,433 parts In-Stock

1+ parts

$58.604

100+ parts

$48.055

1k+ parts

-

10k+ parts

-

3,433

$58.604

$48.055

-

-

IDEA Electronic Components Group

UK . 2,011 parts In-Stock

1+ parts

$58.604

100+ parts

$55.674

1k+ parts

$52.744

10k+ parts

-

2,011

$58.604

$55.674

$52.744

-

Overview

Experience the power and efficiency of the Texas Instruments MSP430FR68891IPZ microcontroller, a versatile solution for your electronic projects. With integrated cache, low power mode, and a maximum clock frequency of 24 MHz, this device offers unparalleled performance and reliability. Ideal for applications in industrial settings, the MSP430FR68891IPZ boasts advanced features such as 16-channel ADC, 3 DMA channels, and 5 timers. Trust Texas Instruments for cutting-edge technology and superior quality in every product, ensuring you always stay ahead of the game. Upgrade your projects today with the MSP430FR68891IPZ and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and cost-effective, ideal for portable and budget-friendly applications.

Integrated Cache: YES

Integrated cache helps in faster execution of instructions and data retrieval, improving overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

Ability to operate at high supply voltage allows for flexibility in powering the microcontroller in various applications.

ROM Words: 131072

Large ROM capacity of 131072 words provides ample space for program storage, enabling complex algorithms and functionalities to be implemented.

No. of Timers: 5

Multiple timers enable efficient time management and synchronization of tasks within the microcontroller, enhancing its versatility in handling diverse operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered devices and reliable in noisy environments.

Technical Specifications

Microcontrollers MSP430FR68891IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

83

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR68891IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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