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MSP430FR68891IPN

Texas Instruments

MSP430FR68891IPN by Texas Instruments

MSP430FR68891IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12 ADC channels. Ideal for industrial applications, it operates b/w -40 to 85°C, features low power mode, and offers up to 24 MHz clock frequency.

Median Price

$8.335

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$8.335

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100

$8.335

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Vyrian

USA . 5,600 parts In-Stock

1+ parts

-

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-

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5,600

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Digiode

USA . 311 parts In-Stock

1+ parts

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311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 253 parts In-Stock

1+ parts

$8.335

100+ parts

-

1k+ parts

-

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$8.168

253

$8.335

-

-

$8.168

Corohmni

South Africa . 36 parts In-Stock

1+ parts

$8.335

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-

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36

$8.335

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$8.501

100+ parts

$8.501

1k+ parts

$8.501

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-

600

$8.501

$8.501

$8.501

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$10.910

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559

$10.910

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Semicontronic

India . 1,590 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

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1,590

$13.000

$12.675

$12.610

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Ampacity Inc.

Singapore . 269 parts In-Stock

1+ parts

$19.000

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269

$19.000

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Microchip USA

USA . 2,846 parts In-Stock

1+ parts

$19.640

100+ parts

$19.360

1k+ parts

$19.220

10k+ parts

$19.080

2,846

$19.640

$19.360

$19.220

$19.080

One Stop Electronics

USA . 1,057 parts In-Stock

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$27.000

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1,057

$27.000

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

$39.856

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1,731

$39.856

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DigiPath Technology Company

USA . 1,857 parts In-Stock

1+ parts

$43.886

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1,857

$43.886

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ChromeModa Solutions

Germany . 4,661 parts In-Stock

1+ parts

$44.782

100+ parts

$36.721

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4,661

$44.782

$36.721

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$44.782

100+ parts

$42.543

1k+ parts

$40.304

10k+ parts

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1,406

$44.782

$42.543

$40.304

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Argo Parts USA

USA . 2,469 parts In-Stock

1+ parts

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2,469

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Corphita

USA . 337 parts In-Stock

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337

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$8.168

1k+ parts

$7.918

10k+ parts

$7.751

100

-

$8.168

$7.918

$7.751

Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430FR68891IPN Microcontroller. With its advanced technology and reliable performance, Texas Instruments has established itself as a trusted manufacturer in the industry. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers looking for high-quality components. Experience seamless connectivity, low power consumption, and innovative features that will take your projects to the next level. Elevate your designs with the MSP430FR68891IPN and discover endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring it can withstand harsh environmental conditions.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the microcontroller, making it suitable for high-performance applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with various power sources.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities for sensor-based applications.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for fast processing and execution of instructions, making the microcontroller suitable for applications requiring quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller, it offers efficient and streamlined instruction execution, leading to better performance and power efficiency.

RAM Bytes: 2048

With a sufficient amount of Random Access Memory (RAM), the microcontroller can store and process data efficiently, enabling multitasking and complex computations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making the microcontroller energy-efficient and versatile.

Technical Specifications

Microcontrollers MSP430FR68891IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR68891IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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