Loading...

MSP430FR6888IPZR

Texas Instruments

MSP430FR6888IPZR by Texas Instruments

MSP430FR6888IPZR by Texas Instruments is a 16-bit microcontroller with 98304 ROM words, 2048 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities. Features include FRAM ROM programmability, 83 I/O lines, and connectivity through EUSCI(4) interface.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,839

-

-

-

-

Digiode

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 834 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

834

$12.000

-

-

-

AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$19.648

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$19.648

-

-

-

Microchip USA

USA . 383 parts In-Stock

1+ parts

$26.170

100+ parts

$26.010

1k+ parts

$25.930

10k+ parts

$25.850

383

$26.170

$26.010

$25.930

$25.850

Parana Technologies

USA . 2,018 parts In-Stock

1+ parts

$75.227

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

$75.227

-

-

-

DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$82.834

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

$82.834

-

-

-

ChromeModa Solutions

Germany . 932 parts In-Stock

1+ parts

$84.525

100+ parts

$69.310

1k+ parts

-

10k+ parts

-

932

$84.525

$69.310

-

-

IDEA Electronic Components Group

UK . 299 parts In-Stock

1+ parts

$84.525

100+ parts

$80.299

1k+ parts

$76.072

10k+ parts

-

299

$84.525

$80.299

$76.072

-

Corphita

USA . 2,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,605

-

-

-

-

Overview

Experience the cutting-edge technology of Texas Instruments with the MSP430FR6888IPZR microcontroller. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. From its efficient power management to its advanced peripherals, this microcontroller provides unmatched value and benefits to customers looking for reliable performance. Trust in Texas Instruments to deliver top-of-the-line products that exceed expectations and drive innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package body ensures portability and long-term reliability of the product.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of operating voltages, providing flexibility in power supply options.

Bit Size: 16

Offers high processing capabilities and performance for various applications.

No. of Terminals: 100

Sufficient number of terminals for connectivity and interfacing with external components and peripherals.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast data processing and real-time operation.

RAM Bytes: 2048

Adequate memory capacity for storing and accessing data during operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient operation and resource utilization, making the microcontroller suitable for various applications.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog-to-digital conversions, making the microcontroller suitable for sensor interfacing.

Technical Specifications

Microcontrollers MSP430FR6888IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

98304

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6888IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20