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MSP430FR6888IPNR

Texas Instruments

MSP430FR6888IPNR by Texas Instruments

MSP430FR6888IPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 24 MHz. It features 12 ADC channels, 3 DMA channels, and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,180 parts In-Stock

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8,180

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Digiode

USA . 1,742 parts In-Stock

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1,742

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Distributors (Availability)

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AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$7.497

100+ parts

-

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531

$7.497

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Parana Technologies

USA . 2,035 parts In-Stock

1+ parts

$19.157

100+ parts

-

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$19.206

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2,035

$19.157

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$19.206

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DigiPath Technology Company

USA . 198 parts In-Stock

1+ parts

$21.094

100+ parts

$19.407

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198

$21.094

$19.407

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IDEA Electronic Components Group

UK . 1,598 parts In-Stock

1+ parts

$21.525

100+ parts

$20.449

1k+ parts

$19.372

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1,598

$21.525

$20.449

$19.372

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ChromeModa Solutions

Germany . 914 parts In-Stock

1+ parts

$21.525

100+ parts

$17.650

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914

$21.525

$17.650

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One Stop Electronics

USA . 308 parts In-Stock

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$25.000

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308

$25.000

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Microchip USA

USA . 437 parts In-Stock

1+ parts

$25.090

100+ parts

$24.940

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$24.860

10k+ parts

$24.780

437

$25.090

$24.940

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$24.780

Corphita

USA . 640 parts In-Stock

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640

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Overview

Unlock the potential of your projects with the MSP430FR6888IPNR by Texas Instruments, a high-quality microcontroller designed to provide unmatched performance and reliability. With its cutting-edge technology and innovative features, this product is perfect for a wide range of applications in various industries. Experience the value and benefits of Texas Instruments' superior craftsmanship, as you enjoy seamless connectivity, efficient power management, and advanced functionality. Trust in the MSP430FR6888IPNR to bring your ideas to life and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and allows for compatibility with a wide range of voltage sources.

ADC Channels: YES

Analog to Digital Convertors allow for interfacing with analog sensors and peripherals, expanding the functionality of the microcontroller.

DMA Channels: YES

Direct Memory Access channels help in efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 98304

Large ROM size allows for storing complex program codes and data, making the microcontroller suitable for applications requiring extensive memory capacity.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds, enhancing the overall performance of the microcontroller.

RAM Bytes: 2048

Adequate RAM size allows for temporary storage of data and variables during program execution, facilitating smooth operation of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing of instructions, resulting in high performance and low power consumption.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with high resolution allow for accurate conversion of analog signals to digital data, enhancing the precision of sensor readings and measurements.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog outputs, making it ideal for applications such as motor control and audio modulation.

Technical Specifications

Microcontrollers MSP430FR6888IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

63

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

98304

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6888IPNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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