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MSP430FR6887IPZ

Texas Instruments

MSP430FR6887IPZ by Texas Instruments

MSP430FR6887IPZ by Texas Instruments is a 16-bit microcontroller with 83 I/O lines, 16 ADC channels, and 3 DMA channels. Ideal for industrial applications, it operates at up to 24 MHz with low power mode support and features FRAM ROM programmability.

Median Price

$4.057

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,040 parts In-Stock

1+ parts

$4.057

100+ parts

$3.308

1k+ parts

$2.205

10k+ parts

-

7,040

$4.057

$3.308

$2.205

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,714 parts In-Stock

1+ parts

$3.854

100+ parts

-

1k+ parts

-

10k+ parts

-

2,714

$3.854

-

-

-

Vyrian

USA . 4,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,313

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,026 parts In-Stock

1+ parts

$3.651

100+ parts

-

1k+ parts

-

10k+ parts

-

2,026

$3.651

-

-

-

AZTECH Wire

Italy . 81 parts In-Stock

1+ parts

$14.420

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$14.420

-

-

-

Microchip USA

USA . 2,998 parts In-Stock

1+ parts

$26.780

100+ parts

$26.620

1k+ parts

$26.530

10k+ parts

$26.450

2,998

$26.780

$26.620

$26.530

$26.450

Parana Technologies

USA . 130 parts In-Stock

1+ parts

$42.128

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$42.128

-

-

-

DigiPath Technology Company

USA . 1,773 parts In-Stock

1+ parts

$46.388

100+ parts

$42.677

1k+ parts

-

10k+ parts

-

1,773

$46.388

$42.677

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-

ChromeModa Solutions

Germany . 6,986 parts In-Stock

1+ parts

$47.335

100+ parts

$38.815

1k+ parts

-

10k+ parts

-

6,986

$47.335

$38.815

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IDEA Electronic Components Group

UK . 40 parts In-Stock

1+ parts

$47.335

100+ parts

$44.968

1k+ parts

$42.602

10k+ parts

-

40

$47.335

$44.968

$42.602

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR6887IPZ microcontroller. Designed with cutting-edge technology and top-quality materials, this device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR6887IPZ provides low power consumption, integrated cache, and multiple peripherals to streamline your projects. Take advantage of its advanced features, high-speed clock frequency, and versatile connectivity to bring your ideas to life. Elevate your designs with the MSP430FR6887IPZ and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, allowing for easy handling and added protection.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microcontroller by storing frequently accessed data for quicker access.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can provide better performance and efficiency in applications that require higher power consumption.

On Chip Data RAM Width: 8

Wider data RAM width allows for faster data transfer and processing, enhancing the speed and efficiency of the microcontroller.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and flexibility in connecting external devices, making it suitable for complex applications.

Maximum Clock Frequency: 24 MHz

Higher clock frequency enables faster execution of instructions, leading to improved performance and responsiveness in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and streamlined execution of instructions, making it a suitable choice for applications requiring high performance and low power consumption.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16-channel 12-bit ADCs enables accurate and simultaneous analog-to-digital conversion of multiple signals, making it ideal for applications that require precise sensor measurements.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption during idle periods, extending the battery life and making it suitable for use in battery-powered devices.

Technical Specifications

Microcontrollers MSP430FR6887IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

83

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6887IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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