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MSP430FR6879IPN

Texas Instruments

MSP430FR6879IPN by Texas Instruments

MSP430FR6879IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12 ADC channels. Ideal for industrial applications requiring low power consumption, it features 5 timers, DMA support, and FRAM programmability. Operating temperature ranges from -40 to 85°C.

Median Price

$6.252

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,481 parts In-Stock

1+ parts

$6.252

100+ parts

$5.097

1k+ parts

$3.398

10k+ parts

-

6,481

$6.252

$5.097

$3.398

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,823 parts In-Stock

1+ parts

$5.939

100+ parts

-

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4,823

$5.939

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$6.930

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600

$6.930

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Bristol Electronics

USA . 113 parts In-Stock

1+ parts

$8.992

100+ parts

$4.226

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113

$8.992

$4.226

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Vyrian

USA . 2,448 parts In-Stock

1+ parts

-

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2,448

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ACDS - Activité Composants Distribution Service

France . 113 parts In-Stock

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113

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Dan-Mar Components

USA . 113 parts In-Stock

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113

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,364 parts In-Stock

1+ parts

$5.310

100+ parts

-

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6,364

$5.310

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Semicontronic

India . 6,024 parts In-Stock

1+ parts

$5.310

100+ parts

$5.177

1k+ parts

$5.151

10k+ parts

-

6,024

$5.310

$5.177

$5.151

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Corphita

USA . 1,230 parts In-Stock

1+ parts

$5.627

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1,230

$5.627

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Corohmni

South Africa . 77 parts In-Stock

1+ parts

$6.310

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77

$6.310

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Continental Prestige Electronics

USA . 5,271 parts In-Stock

1+ parts

$6.930

100+ parts

-

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10k+ parts

$6.791

5,271

$6.930

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-

$6.791

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$7.069

100+ parts

$7.069

1k+ parts

$7.069

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3,000

$7.069

$7.069

$7.069

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AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$9.500

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715

$9.500

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Parana Technologies

USA . 988 parts In-Stock

1+ parts

$14.218

100+ parts

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$14.670

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988

$14.218

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$14.670

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DigiPath Technology Company

USA . 2,240 parts In-Stock

1+ parts

$15.656

100+ parts

$14.403

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2,240

$15.656

$14.403

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ChromeModa Solutions

Germany . 5,590 parts In-Stock

1+ parts

$15.975

100+ parts

$13.100

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5,590

$15.975

$13.100

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IDEA Electronic Components Group

UK . 1,847 parts In-Stock

1+ parts

$15.975

100+ parts

$15.176

1k+ parts

$14.378

10k+ parts

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1,847

$15.975

$15.176

$14.378

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Argo Parts USA

USA . 4,286 parts In-Stock

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4,286

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Overview

Enhance your projects with the cutting-edge MSP430FR6879IPN microcontroller by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-of-the-line microcontrollers that are ideal for a wide range of applications. From IoT devices to consumer electronics, this microcontroller offers unparalleled value, benefits, and advantages to customers. With its low power consumption, advanced peripherals, and high-speed performance, the MSP430FR6879IPN is the perfect choice for your next project. Experience the difference with Texas Instruments' industry-leading technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various systems.

CPU Family: MSP430

Known for low power consumption, making it ideal for battery-powered applications.

ROM Words: 131072

Ample memory capacity for storing program instructions and data.

Maximum Clock Frequency: 24 MHz

Provides the necessary processing speed for handling complex tasks efficiently.

Analog To Digital Convertors: 12-Ch 12-Bit

Enables precise conversion of analog signals to digital data for accurate measurements and control.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for improved performance and power efficiency.

Connectivity: EUSCI(4)

Supports versatile communication interfaces for seamless connectivity with other components or devices.

Low Power Mode: YES

Enhances energy efficiency by enabling the microcontroller to operate in a power-saving mode when not in use.

Technical Specifications

Microcontrollers MSP430FR6879IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6879IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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