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MSP430FR6872IPMR

Texas Instruments

MSP430FR6872IPMR by Texas Instruments

MSP430FR6872IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 60,490 parts In-Stock

1+ parts

$3.842

100+ parts

$3.132

1k+ parts

$2.088

10k+ parts

-

60,490

$3.842

$3.132

$2.088

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,106 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

-

4,106

$3.650

-

-

-

Maritex

Poland . 2,000 parts In-Stock

1+ parts

$5.869

100+ parts

$3.684

1k+ parts

$2.990

10k+ parts

-

2,000

$5.869

$3.684

$2.990

-

Vyrian

USA . 4,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,396

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,126 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

-

10k+ parts

-

4,126

$3.458

-

-

-

AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

10k+ parts

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677

$11.600

-

-

-

Parana Technologies

USA . 765 parts In-Stock

1+ parts

$51.611

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$51.611

-

-

-

ChromeModa Solutions

Germany . 3,826 parts In-Stock

1+ parts

$57.990

100+ parts

$47.552

1k+ parts

-

10k+ parts

-

3,826

$57.990

$47.552

-

-

IDEA Electronic Components Group

UK . 2,156 parts In-Stock

1+ parts

$57.990

100+ parts

$55.090

1k+ parts

$52.191

10k+ parts

-

2,156

$57.990

$55.090

$52.191

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QUARKTWIN TECHNOLOGY LTD

USA . 19,903 parts In-Stock

1+ parts

-

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19,903

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Lixinc

USA . 16,955 parts In-Stock

1+ parts

-

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16,955

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iodParts Technologies Inc.

India . 1,990 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,990

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DigiPath Technology Company

USA . 916 parts In-Stock

1+ parts

-

100+ parts

$52.284

1k+ parts

-

10k+ parts

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916

-

$52.284

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-

Overview

Elevate your projects with the Texas Instruments MSP430FR6872IPMR Microcontroller, designed for top-notch performance and reliability. As a leader in the industry, Texas Instruments ensures quality and innovation in every product. This microcontroller offers a wide range of applications, from IoT devices to consumer electronics, providing value and efficiency to your designs. Experience the benefits of its low power mode, multiple peripherals, and advanced technology, making it the perfect choice for your next project. Elevate your designs with the MSP430FR6872IPMR and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals.

Bit Size: 16

With a 16-bit architecture, the microcontroller can process larger chunks of data at once, leading to faster and more efficient operation.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors or signals, expanding its range of applications.

DMA Channels: YES

Direct Memory Access (DMA) channels reduce CPU load by allowing peripherals to transfer data directly to memory, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture enhances processing speed and efficiency, making the microcontroller suitable for high-performance applications.

RAM Bytes: 2048

With 2048 bytes of Random Access Memory (RAM), the microcontroller can store and access data quickly, enhancing multitasking capabilities.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options like IRDA, I2C, SPI, and UART allow the microcontroller to communicate with a variety of external devices, improving integration possibilities.

Technical Specifications

Microcontrollers MSP430FR6872IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6872IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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