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MSP430FR68721IPMR

Texas Instruments

MSP430FR68721IPMR by Texas Instruments

MSP430FR68721IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,950 parts In-Stock

1+ parts

$3.842

100+ parts

$3.132

1k+ parts

$2.088

10k+ parts

-

4,950

$3.842

$3.132

$2.088

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 457 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

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457

$3.650

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-

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Vyrian

USA . 2,906 parts In-Stock

1+ parts

-

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-

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2,906

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,811 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

-

10k+ parts

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4,811

$3.458

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Microchip USA

USA . 1,476 parts In-Stock

1+ parts

$19.190

100+ parts

$19.070

1k+ parts

$19.010

10k+ parts

$18.950

1,476

$19.190

$19.070

$19.010

$18.950

AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$20.780

100+ parts

-

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789

$20.780

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Parana Technologies

USA . 1,644 parts In-Stock

1+ parts

$66.268

100+ parts

-

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1,644

$66.268

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ChromeModa Solutions

Germany . 6,964 parts In-Stock

1+ parts

$74.458

100+ parts

$61.056

1k+ parts

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6,964

$74.458

$61.056

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IDEA Electronic Components Group

UK . 603 parts In-Stock

1+ parts

$74.458

100+ parts

$70.735

1k+ parts

$67.012

10k+ parts

-

603

$74.458

$70.735

$67.012

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DigiPath Technology Company

USA . 967 parts In-Stock

1+ parts

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$67.131

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967

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$67.131

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Overview

Discover the Texas Instruments MSP430FR68721IPMR microcontroller, a cutting-edge solution for a wide range of applications. With its high-quality manufacturing and innovative technology, this product offers unparalleled value to customers. Whether you're looking to enhance your IoT devices, power management systems, or industrial automation projects, the MSP430FR68721IPMR delivers superior performance and efficiency. Trust in Texas Instruments to provide reliable and versatile microcontrollers that push the boundaries of what's possible in the world of electronics. Upgrade your designs today with the MSP430FR68721IPMR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in the production process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with a wide range of power sources.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Bit Size: 16

The 16-bit architecture provides enhanced performance and processing capabilities compared to lower bit sizes, making it suitable for complex tasks.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store and execute complex programs and algorithms efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers high performance with reduced instruction set complexity, making the microcontroller efficient in handling tasks.

RAM Bytes: 2048

The ample RAM capacity allows for efficient data storage and manipulation, improving overall system performance.

ADC Channels: YES

The built-in ADC channels enable analog sensor interfacing and data conversion, expanding the microcontroller's application capabilities.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory without CPU intervention, improving system performance and responsiveness.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options allow for seamless communication with external devices and systems, enhancing the microcontroller's versatility.

Low Power Mode: YES

The low power mode enables energy-efficient operation, extending battery life in portable and battery-powered devices.

Technical Specifications

Microcontrollers MSP430FR68721IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR68721IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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