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MSP430FR6822IPMR

Texas Instruments

MSP430FR6822IPMR by Texas Instruments

MSP430FR6822IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.836

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,550 parts In-Stock

1+ parts

$3.836

100+ parts

$3.128

1k+ parts

$2.085

10k+ parts

-

3,550

$3.836

$3.128

$2.085

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 700 parts In-Stock

1+ parts

$3.644

100+ parts

-

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-

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-

700

$3.644

-

-

-

Vyrian

USA . 5,208 parts In-Stock

1+ parts

-

100+ parts

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5,208

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HZD GmbH

Germany . 1,950 parts In-Stock

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1,950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,915 parts In-Stock

1+ parts

$3.452

100+ parts

-

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2,915

$3.452

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Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$13.848

100+ parts

-

1k+ parts

$14.329

10k+ parts

-

2,050

$13.848

-

$14.329

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DigiPath Technology Company

USA . 86 parts In-Stock

1+ parts

$15.248

100+ parts

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86

$15.248

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-

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ChromeModa Solutions

Germany . 2,256 parts In-Stock

1+ parts

$15.559

100+ parts

$12.758

1k+ parts

-

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2,256

$15.559

$12.758

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IDEA Electronic Components Group

UK . 1,291 parts In-Stock

1+ parts

$15.559

100+ parts

$14.781

1k+ parts

$14.003

10k+ parts

-

1,291

$15.559

$14.781

$14.003

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AZTECH Wire

Italy . 572 parts In-Stock

1+ parts

$18.510

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572

$18.510

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Microchip USA

USA . 2,378 parts In-Stock

1+ parts

$19.160

100+ parts

$19.050

1k+ parts

$18.990

10k+ parts

$18.930

2,378

$19.160

$19.050

$18.990

$18.930

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR6822IPMR microcontroller, a cutting-edge solution designed to revolutionize your projects. With Texas Instruments' reputation for excellence in manufacturing and the endless possibilities of microcontroller applications, this product offers unparalleled value to customers seeking top-notch performance and reliability. Experience the benefits of advanced technology and seamless connectivity with the MSP430FR6822IPMR, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more flexibility in power options and the ability to interface with a variety of components.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage allows for energy efficiency and can be ideal for battery-powered applications.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfers without involving the CPU, enhancing overall performance.

ROM Words: 65536

Large ROM capacity provides ample space for program storage and data handling, accommodating complex applications.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds, enhancing the performance of time-sensitive applications.

RAM Bytes: 2048

A generous amount of RAM allows for efficient data manipulation and multitasking capabilities, improving overall system performance.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals, essential for precise sensor measurements.

Connectivity: IRDA, I2C, SPI(2), UART

Various connectivity options such as Infrared Data Association, Inter-Integrated Circuit, Serial Peripheral Interface, and Universal Asynchronous Receiver-Transmitter enhance communication capabilities with external devices.

Technical Specifications

Microcontrollers MSP430FR6822IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6822IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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