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MSP430FR68221IG56R

Texas Instruments

MSP430FR68221IG56R by Texas Instruments

MSP430FR68221IG56R by Texas Instruments is a 16-bit microcontroller with 65536 ROM words, 2048 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers low power mode, operates b/w -40 to 85 °C, and supports peripherals like BOR, CRC, DMA(3), LCD, PWM.

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,940 parts In-Stock

1+ parts

$3.798

100+ parts

$3.096

1k+ parts

$2.064

10k+ parts

-

5,940

$3.798

$3.096

$2.064

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,261 parts In-Stock

1+ parts

$3.608

100+ parts

-

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3,261

$3.608

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Vyrian

USA . 3,562 parts In-Stock

1+ parts

-

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3,562

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,311 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

-

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3,311

$3.418

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AZTECH Wire

Italy . 416 parts In-Stock

1+ parts

$11.940

100+ parts

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416

$11.940

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Microchip USA

USA . 2,325 parts In-Stock

1+ parts

$18.020

100+ parts

$17.910

1k+ parts

$17.860

10k+ parts

$17.800

2,325

$18.020

$17.910

$17.860

$17.800

Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

$53.971

100+ parts

-

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2,218

$53.971

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DigiPath Technology Company

USA . 1,320 parts In-Stock

1+ parts

$59.429

100+ parts

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1,320

$59.429

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ChromeModa Solutions

Germany . 4,345 parts In-Stock

1+ parts

$60.642

100+ parts

$49.726

1k+ parts

-

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4,345

$60.642

$49.726

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IDEA Electronic Components Group

UK . 830 parts In-Stock

1+ parts

$60.642

100+ parts

$57.610

1k+ parts

$54.578

10k+ parts

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830

$60.642

$57.610

$54.578

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR68221IG56R microcontroller. Crafted with precision and expertise, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller boasts advanced features like DMA channels and low power mode. Experience seamless connectivity with IRDA, I2C, SPI, and UART options. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the MSP430FR68221IG56R and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the microcontroller suitable for various applications.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and complexity for a wide range of applications.

ADC Channels: YES

Enables analog to digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses Reduced Instruction Set Computing architecture for efficient execution of instructions, enhancing processing speed.

RAM Bytes: 2048

Sufficient memory for data storage and manipulation, enabling complex applications to run smoothly.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Nominal Supply Voltage: 3 V

Suitable for a wide range of power supply options while maintaining stability and performance.

Connectivity: IRDA, I2C, SPI(2), UART

Provides various communication interfaces for seamless integration with other devices in a system.

Technical Specifications

Microcontrollers MSP430FR68221IG56R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR68221IG56R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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