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MSP430FR6820IRGCR

Texas Instruments

MSP430FR6820IRGCR by Texas Instruments

MSP430FR6820IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADCs, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$2.973

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,480 parts In-Stock

1+ parts

$2.973

100+ parts

$2.424

1k+ parts

$1.616

10k+ parts

-

5,480

$2.973

$2.424

$1.616

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,120 parts In-Stock

1+ parts

$2.824

100+ parts

-

1k+ parts

-

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-

3,120

$2.824

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Vyrian

USA . 6,400 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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6,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,861 parts In-Stock

1+ parts

$2.676

100+ parts

-

1k+ parts

-

10k+ parts

-

2,861

$2.676

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-

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$14.060

100+ parts

-

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10k+ parts

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276

$14.060

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Parana Technologies

USA . 2,057 parts In-Stock

1+ parts

$70.536

100+ parts

-

1k+ parts

-

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2,057

$70.536

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-

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DigiPath Technology Company

USA . 536 parts In-Stock

1+ parts

$77.669

100+ parts

-

1k+ parts

-

10k+ parts

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536

$77.669

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-

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ChromeModa Solutions

Germany . 3,691 parts In-Stock

1+ parts

$79.254

100+ parts

$64.988

1k+ parts

-

10k+ parts

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3,691

$79.254

$64.988

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IDEA Electronic Components Group

UK . 1,856 parts In-Stock

1+ parts

$79.254

100+ parts

$75.291

1k+ parts

$71.329

10k+ parts

-

1,856

$79.254

$75.291

$71.329

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Overview

Elevate your projects to the next level with the MSP430FR6820IRGCR microcontroller by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers a wide range of applications for this powerful microcontroller. With its low power mode, on-chip program ROM, and FRAM technology, this product provides unmatched value and benefits to customers. Whether you're working on IoT devices, portable electronics, or industrial automation, the MSP430FR6820IRGCR is the perfect solution to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage, making it versatile and compatible with different power sources.

Bit Size: 16

Having a 16-bit architecture enables the microcontroller to process data quickly and efficiently.

ADC Channels: YES

The presence of Analog to Digital Converters allows for precise and accurate conversion of analog signals to digital data.

ROM Words: 32768

Having a significant amount of Read-Only Memory allows for storing a large number of instructions and data for program execution.

Maximum Clock Frequency: 24 MHz

With a high maximum clock frequency, the microcontroller can execute instructions at a faster rate, improving overall performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient and streamlined processing of instructions.

RAM Bytes: 2048

A good amount of Random Access Memory allows for temporary storage of data during program execution, improving efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options such as IRDA, I2C, SPI, and UART enable easy communication with external devices, expanding the microcontroller's functionality.

Technical Specifications

Microcontrollers MSP430FR6820IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6820IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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