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MSP430FR60471IPZ

Texas Instruments

MSP430FR60471IPZ by Texas Instruments

MSP430FR60471IPZ by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 8 RAM words. It features 18-Ch 12-Bit ADC channels, 6 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$20.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,895 parts In-Stock

1+ parts

$16.326

100+ parts

$14.261

1k+ parts

$9.835

10k+ parts

-

1,895

$16.326

$14.261

$9.835

-

DigiKey

USA . 45 parts In-Stock

1+ parts

$20.760

100+ parts

$15.590

1k+ parts

-

10k+ parts

-

45

$20.760

$15.590

-

-

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$20.760

100+ parts

$15.580

1k+ parts

$14.700

10k+ parts

-

33

$20.760

$15.580

$14.700

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,745 parts In-Stock

1+ parts

$15.510

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

$15.510

-

-

-

Vyrian

USA . 7,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,060

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,488 parts In-Stock

1+ parts

$14.693

100+ parts

-

1k+ parts

-

10k+ parts

-

2,488

$14.693

-

-

-

Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$21.489

100+ parts

-

1k+ parts

$21.870

10k+ parts

-

2,276

$21.489

-

$21.870

-

DigiPath Technology Company

USA . 2,143 parts In-Stock

1+ parts

$23.662

100+ parts

-

1k+ parts

-

10k+ parts

-

2,143

$23.662

-

-

-

ChromeModa Solutions

Germany . 3,303 parts In-Stock

1+ parts

$24.145

100+ parts

$19.799

1k+ parts

-

10k+ parts

-

3,303

$24.145

$19.799

-

-

IDEA Electronic Components Group

UK . 1,666 parts In-Stock

1+ parts

$24.145

100+ parts

$22.938

1k+ parts

$21.730

10k+ parts

-

1,666

$24.145

$22.938

$21.730

-

Microchip USA

USA . 1,385 parts In-Stock

1+ parts

$47.980

100+ parts

$47.140

1k+ parts

$46.730

10k+ parts

$46.310

1,385

$47.980

$47.140

$46.730

$46.310

QUARKTWIN TECHNOLOGY LTD

USA . 28,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,435

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the MSP430FR60471IPZ microcontroller from Texas Instruments. Designed with precision and quality in mind, this device offers unparalleled performance and reliability for a wide range of applications. With advanced features such as low power mode and FRAM programmability, this microcontroller provides customers with exceptional value and benefits. Whether you're working on IoT projects, sensor systems, or industrial automation, the MSP430FR60471IPZ delivers unmatched efficiency and innovation to help you bring your ideas to life. Elevate your projects to new heights with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring its longevity in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs during production.

Maximum Supply Voltage: 3.6 V

Having a high maximum supply voltage allows for versatility in power supply options and compatibility with different systems.

On Chip Data RAM Width: 8

The wide data RAM width enables faster access and processing of data within the microcontroller, improving overall performance.

RAM Bytes: 8192

With a large RAM capacity, the microcontroller can handle complex algorithms and store data efficiently for various applications.

Maximum Clock Frequency: 24 MHz

A high clock frequency allows for swift execution of instructions, making the microcontroller suitable for tasks that require real-time processing.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Having a microcontroller with Reduced Instruction Set Computing architecture enhances performance efficiency and speed in executing tasks.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options make the microcontroller versatile for communication with various devices and systems, enhancing its compatibility.

Technical Specifications

Microcontrollers MSP430FR60471IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

76

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

RAM Words:

8

ROM Words:

262144

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

2.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(16), DMA(6), LCD, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

MSP430FR60471IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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