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MSP430FR59941IRGZR

Texas Instruments

MSP430FR59941IRGZR by Texas Instruments

MSP430FR59941IRGZR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 8192 RAM bytes, and 18-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity through I2C, IRDA(2), UART(2) interfaces and features peripherals like BOR, RTC, TIMER(6).

Median Price

$6.063

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,982 parts In-Stock

1+ parts

$6.063

100+ parts

$4.943

1k+ parts

$3.295

10k+ parts

-

1,982

$6.063

$4.943

$3.295

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,300 parts In-Stock

1+ parts

$5.760

100+ parts

-

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4,300

$5.760

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Vyrian

USA . 6,280 parts In-Stock

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-

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6,280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,012 parts In-Stock

1+ parts

$5.457

100+ parts

-

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-

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2,012

$5.457

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$11.610

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642

$11.610

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Parana Technologies

USA . 90 parts In-Stock

1+ parts

$17.068

100+ parts

-

1k+ parts

$17.289

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90

$17.068

-

$17.289

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DigiPath Technology Company

USA . 1,123 parts In-Stock

1+ parts

$18.793

100+ parts

$17.290

1k+ parts

-

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1,123

$18.793

$17.290

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

1+ parts

$19.177

100+ parts

$18.218

1k+ parts

$17.259

10k+ parts

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1,488

$19.177

$18.218

$17.259

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ChromeModa Solutions

Germany . 692 parts In-Stock

1+ parts

$19.177

100+ parts

$15.725

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-

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692

$19.177

$15.725

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Microchip USA

USA . 1,832 parts In-Stock

1+ parts

$28.120

100+ parts

$27.950

1k+ parts

$27.860

10k+ parts

$27.780

1,832

$28.120

$27.950

$27.860

$27.780

Infinite Electronics LLP (Excess)

. 411 parts In-Stock

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411

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Overview

Elevate your projects to new heights with the MSP430FR59941IRGZR microcontroller by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers top-of-the-line solutions in the microcontroller category. This powerful chip offers a wide range of applications, from IoT devices to industrial automation. With its impressive features and capabilities, including 18-channel ADC, 6 DMA channels, and FRAM ROM programmability, this microcontroller provides unmatched value, performance, and flexibility for your projects. Experience the difference with Texas Instruments MSP430FR59941IRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller chip, ensuring its longevity and reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for different applications.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, making this microcontroller energy-efficient and stable in noisy environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with simplified instruction set architecture, enabling faster execution of tasks and efficient use of resources.

PWM Channels: YES

The presence of PWM channels allows for precise control over analog components, making it suitable for applications that require accurate voltage modulation.

Technical Specifications

Microcontrollers MSP430FR59941IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), UART(2)

Peripherals:

BOR, COMPARATOR(16), DMA(6), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

MSP430FR59941IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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