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MSP430FR59941IPMR

Texas Instruments

MSP430FR59941IPMR by Texas Instruments

MSP430FR59941IPMR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 8192 RAM bytes, and 19-Ch 12-Bit ADC channels. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and various peripherals like BOR, RTC, and WDT. It offers connectivity options such as I2C(3), IRDA(3), UART(3) along with FRAM ROM programmability.

Median Price

$6.063

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,597 parts In-Stock

1+ parts

$6.063

100+ parts

$4.943

1k+ parts

$3.295

10k+ parts

-

7,597

$6.063

$4.943

$3.295

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 899 parts In-Stock

1+ parts

$5.760

100+ parts

-

1k+ parts

-

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899

$5.760

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Vyrian

USA . 7,986 parts In-Stock

1+ parts

-

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-

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-

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7,986

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 174 parts In-Stock

1+ parts

$5.457

100+ parts

-

1k+ parts

-

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174

$5.457

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AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$13.230

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-

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255

$13.230

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Parana Technologies

USA . 2,200 parts In-Stock

1+ parts

$24.758

100+ parts

-

1k+ parts

$25.429

10k+ parts

-

2,200

$24.758

-

$25.429

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DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

$27.262

100+ parts

$25.081

1k+ parts

-

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50

$27.262

$25.081

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ChromeModa Solutions

Germany . 4,777 parts In-Stock

1+ parts

$27.818

100+ parts

$22.811

1k+ parts

-

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4,777

$27.818

$22.811

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

1+ parts

$27.818

100+ parts

$26.427

1k+ parts

$25.036

10k+ parts

-

1,716

$27.818

$26.427

$25.036

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Microchip USA

USA . 1,200 parts In-Stock

1+ parts

$29.200

100+ parts

$29.020

1k+ parts

$28.930

10k+ parts

$28.840

1,200

$29.200

$29.020

$28.930

$28.840

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR59941IPMR microcontroller. Built by a trusted manufacturer, this device offers unmatched quality and reliability for a wide range of applications. With advanced features like FRAM technology, DMA channels, and multiple connectivity options, this microcontroller provides exceptional value and performance to customers. Whether you're designing IoT devices, industrial controls, or wearable tech, the MSP430FR59941IPMR is the perfect solution to bring your ideas to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for fast processing and responsiveness in applications where real-time data processing is crucial.

RAM Bytes: 8192

With a large RAM capacity, this microcontroller can handle complex computations and store a significant amount of data in memory.

ADC Channels: YES

The built-in Analog to Digital Converters enable the microcontroller to interface with analog sensors and convert their readings into digital values for processing.

Peripherals: BOR, COMPARATOR(16), DMA(6), POR, RTC, TIMER(6), WDT

Having a variety of peripherals allows for versatile functionality and customization in different applications, such as power management, timing, and communication.

ROM Words: 262144

The large ROM capacity provides ample space for storing program instructions and data, making the microcontroller suitable for complex algorithms and applications.

Connectivity: I2C(3), IRDA(3), UART(3)

Multiple communication interfaces allow for flexible connectivity options with other devices, enabling seamless data transfer and control in a networked environment.

Technical Specifications

Microcontrollers MSP430FR59941IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), UART(3)

Peripherals:

BOR, COMPARATOR(16), DMA(6), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

19-Ch 12-Bit

Trade Compliance

MSP430FR59941IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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