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MSP430FR59891IPM

Texas Instruments

MSP430FR59891IPM by Texas Instruments

MSP430FR59891IPM by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, CRC, and DMA along with connectivity options such as I2C and UART.

Median Price

$5.800

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,490 parts In-Stock

1+ parts

$5.800

100+ parts

$4.728

1k+ parts

$3.152

10k+ parts

-

10,490

$5.800

$4.728

$3.152

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,191 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$5.510

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.814

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.814

-

-

-

Vyrian

USA . 10,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,463

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,341 parts In-Stock

1+ parts

$4.930

100+ parts

-

1k+ parts

-

10k+ parts

-

10,341

$4.930

-

-

-

Semicontronic

India . 10,098 parts In-Stock

1+ parts

$4.930

100+ parts

$4.807

1k+ parts

$4.782

10k+ parts

-

10,098

$4.930

$4.807

$4.782

-

Corphita

USA . 2,671 parts In-Stock

1+ parts

$5.220

100+ parts

-

1k+ parts

-

10k+ parts

-

2,671

$5.220

-

-

-

Corohmni

South Africa . 643 parts In-Stock

1+ parts

$5.814

100+ parts

-

1k+ parts

-

10k+ parts

-

643

$5.814

-

-

-

Continental Prestige Electronics

USA . 3,992 parts In-Stock

1+ parts

$5.814

100+ parts

-

1k+ parts

-

10k+ parts

$5.698

3,992

$5.814

-

-

$5.698

Advanced Electronics

New Zealand . 23 parts In-Stock

1+ parts

$5.988

100+ parts

$5.689

1k+ parts

$5.689

10k+ parts

-

23

$5.988

$5.689

$5.689

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$19.260

100+ parts

-

1k+ parts

-

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560

$19.260

-

-

-

Parana Technologies

USA . 848 parts In-Stock

1+ parts

$72.297

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$72.297

-

-

-

DigiPath Technology Company

USA . 969 parts In-Stock

1+ parts

$79.608

100+ parts

-

1k+ parts

-

10k+ parts

-

969

$79.608

-

-

-

ChromeModa Solutions

Germany . 4,678 parts In-Stock

1+ parts

$81.233

100+ parts

$66.611

1k+ parts

-

10k+ parts

-

4,678

$81.233

$66.611

-

-

IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$81.233

100+ parts

$77.171

1k+ parts

$73.110

10k+ parts

-

2,080

$81.233

$77.171

$73.110

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Argo Parts USA

USA . 2,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,662

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.698

1k+ parts

$5.523

10k+ parts

$5.407

1,000

-

$5.698

$5.523

$5.407

Overview

Discover the cutting-edge MSP430FR59891IPM microcontroller by Texas Instruments, a leader in innovative technology. This versatile device is perfect for a wide range of applications thanks to its advanced features and high-quality design. With low power consumption and an array of peripherals including ADC channels, DMA channels, and PWM channels, this microcontroller offers unmatched value and performance. Unlock endless possibilities for your projects with the MSP430FR59891IPM and experience the quality and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle a wide range of power inputs.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM allows for efficient data processing and storage.

Package Shape: SQUARE

The square package shape makes it easy to arrange and place multiple components on a board.

Bit Size: 16

The 16-bit size allows for handling of larger data sets and processing capabilities.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compact and space-saving design for applications with limited space.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement ensures efficient power usage and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial and harsh environments.

Technical Specifications

Microcontrollers MSP430FR59891IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR59891IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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