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MSP430FR5988IPM

Texas Instruments

MSP430FR5988IPM by Texas Instruments

MSP430FR5988IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 12 ADC channels, 3 DMA channels, and peripherals like BOD and RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.761

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,990 parts In-Stock

1+ parts

$5.761

100+ parts

$4.697

1k+ parts

$3.131

10k+ parts

-

1,990

$5.761

$4.697

$3.131

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,941 parts In-Stock

1+ parts

$5.473

100+ parts

-

1k+ parts

-

10k+ parts

-

4,941

$5.473

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-

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Vyrian

USA . 7,334 parts In-Stock

1+ parts

-

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-

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-

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7,334

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,559 parts In-Stock

1+ parts

$5.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,559

$5.185

-

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Microchip USA

USA . 1,957 parts In-Stock

1+ parts

$15.760

100+ parts

$15.540

1k+ parts

$15.420

10k+ parts

$15.310

1,957

$15.760

$15.540

$15.420

$15.310

AZTECH Wire

Italy . 986 parts In-Stock

1+ parts

$20.430

100+ parts

-

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986

$20.430

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Parana Technologies

USA . 978 parts In-Stock

1+ parts

$23.331

100+ parts

$2,166.670

1k+ parts

$20.998

10k+ parts

-

978

$23.331

$2,166.670

$20.998

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DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$25.691

100+ parts

-

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-

10k+ parts

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449

$25.691

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ChromeModa Solutions

Germany . 6,066 parts In-Stock

1+ parts

$26.215

100+ parts

$21.496

1k+ parts

-

10k+ parts

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6,066

$26.215

$21.496

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IDEA Electronic Components Group

UK . 90 parts In-Stock

1+ parts

$26.215

100+ parts

$24.904

1k+ parts

$23.594

10k+ parts

-

90

$26.215

$24.904

$23.594

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QUARKTWIN TECHNOLOGY LTD

USA . 23,750 parts In-Stock

1+ parts

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23,750

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Component Stockers USA

USA . 1,790 parts In-Stock

1+ parts

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1,790

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Overview

Elevate your projects with the Texas Instruments MSP430FR5988IPM microcontroller. With a reputation for quality and innovation, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unparalleled value, efficiency, and performance. From industrial automation to consumer electronics, the MSP430FR5988IPM empowers you to bring your ideas to life with ease. Experience the difference with Texas Instruments and unlock endless possibilities for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring reliable performance in various environments.

Maximum Supply Voltage: 3.6 V

Allows for the microcontroller to operate at a higher voltage, increasing its versatility in different applications.

ADC Channels: YES

Availability of Analog to Digital Convertor channels enables the microcontroller to interface with various sensors and external analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller allows for efficient processing of instructions, leading to faster performance and reduced power consumption.

ROM Programmability: FLASH

Flash ROM enables the microcontroller to be easily reprogrammed and updated, making it flexible for different applications and future enhancements.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Multiple connectivity options provide versatility for communication with different devices and systems, enhancing the microcontroller's application range.

Technical Specifications

Microcontrollers MSP430FR5988IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5988IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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