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MSP430FR5972IPM

Texas Instruments

MSP430FR5972IPM by Texas Instruments

MSP430FR5972IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 24 MHz. It features 8 ADC channels, 3 DMA channels, and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.558

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,910 parts In-Stock

1+ parts

$4.558

100+ parts

$3.716

1k+ parts

$2.477

10k+ parts

-

11,910

$4.558

$3.716

$2.477

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,072 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

-

3,072

$4.330

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-

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Vyrian

USA . 2,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,937

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,885 parts In-Stock

1+ parts

$4.102

100+ parts

-

1k+ parts

-

10k+ parts

-

1,885

$4.102

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-

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AZTECH Wire

Italy . 1,142 parts In-Stock

1+ parts

$15.380

100+ parts

-

1k+ parts

-

10k+ parts

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1,142

$15.380

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-

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Microchip USA

USA . 2,596 parts In-Stock

1+ parts

$30.080

100+ parts

$29.900

1k+ parts

$29.810

10k+ parts

$29.710

2,596

$30.080

$29.900

$29.810

$29.710

Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$36.754

100+ parts

-

1k+ parts

-

10k+ parts

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1,747

$36.754

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-

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DigiPath Technology Company

USA . 1,337 parts In-Stock

1+ parts

$40.471

100+ parts

-

1k+ parts

-

10k+ parts

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1,337

$40.471

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-

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ChromeModa Solutions

Germany . 2,534 parts In-Stock

1+ parts

$41.297

100+ parts

$33.864

1k+ parts

-

10k+ parts

-

2,534

$41.297

$33.864

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IDEA Electronic Components Group

UK . 349 parts In-Stock

1+ parts

$41.297

100+ parts

$39.232

1k+ parts

$37.167

10k+ parts

-

349

$41.297

$39.232

$37.167

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430FR5972IPM microcontroller. Designed for efficiency and reliability, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched performance and precision. With its low power consumption and advanced features like FRAM ROM programmability, you can trust that your projects will run smoothly and efficiently. Experience the difference with Texas Instruments and take your designs to the next level with the MSP430FR5972IPM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for faster data processing and storage, enhancing the overall performance of the microcontroller.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle larger data sets and perform more complex operations compared to lower bit sizes.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller's peripheral IC type enables efficient and streamlined operation, maximizing performance and energy efficiency.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for speedy data processing, making the microcontroller suitable for applications that require quick response times.

No. of Timers: 5

Multiple timers provide flexibility in managing time-sensitive tasks, enabling the microcontroller to handle a wide range of applications efficiently.

RAM Bytes: 2048

With a generous amount of RAM, the microcontroller can store and access data quickly, improving overall system performance.

Technical Specifications

Microcontrollers MSP430FR5972IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5972IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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