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MSP430FR5970IRGCR

Texas Instruments

MSP430FR5970IRGCR by Texas Instruments

MSP430FR5970IRGCR by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 32KB FRAM ROM. It operates at up to 24MHz, has 8 ADC channels, and features low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$2.915

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$2.915

100+ parts

$2.376

1k+ parts

$1.584

10k+ parts

-

3,950

$2.915

$2.376

$1.584

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,685 parts In-Stock

1+ parts

$2.769

100+ parts

-

1k+ parts

-

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-

1,685

$2.769

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Vyrian

USA . 6,054 parts In-Stock

1+ parts

-

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-

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10k+ parts

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6,054

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,240 parts In-Stock

1+ parts

$2.624

100+ parts

-

1k+ parts

-

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-

1,240

$2.624

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-

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Microchip USA

USA . 4,456 parts In-Stock

1+ parts

$14.414

100+ parts

-

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4,456

$14.414

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AZTECH Wire

Italy . 1,039 parts In-Stock

1+ parts

$14.890

100+ parts

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1,039

$14.890

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Parana Technologies

USA . 1,792 parts In-Stock

1+ parts

$17.134

100+ parts

-

1k+ parts

$17.348

10k+ parts

-

1,792

$17.134

-

$17.348

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DigiPath Technology Company

USA . 1,131 parts In-Stock

1+ parts

$18.867

100+ parts

$17.358

1k+ parts

-

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1,131

$18.867

$17.358

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ChromeModa Solutions

Germany . 888 parts In-Stock

1+ parts

$19.252

100+ parts

$15.787

1k+ parts

-

10k+ parts

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888

$19.252

$15.787

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$19.252

100+ parts

$18.289

1k+ parts

$17.327

10k+ parts

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777

$19.252

$18.289

$17.327

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Overview

Unlock the power of innovation with the MSP430FR5970IRGCR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers customers exceptional value and benefits. With features like low power mode, multiple timers, and 12-bit ADC channels, the MSP430FR5970IRGCR provides the performance and efficiency needed to bring your projects to life. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller, accommodating a range of voltage requirements.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other devices or peripherals.

CPU Family: MSP430

Being part of the MSP430 family ensures reliability, efficiency, and compatibility with a wide range of tools and resources.

ROM Words: 32768

Ample space for program storage, allowing for complex applications to be run efficiently.

Maximum Clock Frequency: 24 MHz

High clock frequency enables quick processing and response times for real-time applications.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution provide accurate analog signal conversion capabilities for sensor interfacing.

PWM Channels: YES

Pulse Width Modulation (PWM) support allows for precise control of output signals, crucial for motor control and power management.

Connectivity: EUSCI(4)

Enhanced Universal Serial Communication Interface enables seamless communication with a variety of external devices.

Low Power Mode: YES

Efficient low power mode conserves energy, extending battery life in portable and IoT applications.

Technical Specifications

Microcontrollers MSP430FR5970IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5970IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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