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MSP430FR5970IPMR

Texas Instruments

MSP430FR5970IPMR by Texas Instruments

MSP430FR5970IPMR by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 32KB FRAM ROM, and 8-channel ADC. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85°C, and connectivity via EUSCI(4) interface. It features 3 DMA channels, 5 timers, and offers high-speed operation up to 24MHz.

Median Price

$3.789

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,353 parts In-Stock

1+ parts

$3.789

100+ parts

$3.089

1k+ parts

$2.059

10k+ parts

-

12,353

$3.789

$3.089

$2.059

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,647 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

4,647

$3.600

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-

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Vyrian

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,172

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,639 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,639

$3.410

-

-

-

Microchip USA

USA . 2,233 parts In-Stock

1+ parts

$18.920

100+ parts

$18.810

1k+ parts

$18.750

10k+ parts

$18.690

2,233

$18.920

$18.810

$18.750

$18.690

AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$19.470

100+ parts

-

1k+ parts

-

10k+ parts

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506

$19.470

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-

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Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$70.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,836

$70.490

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-

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DigiPath Technology Company

USA . 2,161 parts In-Stock

1+ parts

$77.618

100+ parts

$71.409

1k+ parts

-

10k+ parts

-

2,161

$77.618

$71.409

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-

ChromeModa Solutions

Germany . 4,375 parts In-Stock

1+ parts

$79.202

100+ parts

$64.946

1k+ parts

-

10k+ parts

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4,375

$79.202

$64.946

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IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$79.202

100+ parts

$75.242

1k+ parts

$71.282

10k+ parts

-

2,158

$79.202

$75.242

$71.282

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Overview

Unlock the power of advanced technology with the MSP430FR5970IPMR microcontroller by Texas Instruments. Designed to meet the highest quality standards, this innovative product offers a wide range of applications in various industries. From low power consumption to high-speed performance, this microcontroller delivers exceptional value and benefits to customers looking for reliable solutions. Experience the advantages of Texas Instruments' expertise in microcontrollers and elevate your projects to new heights with the MSP430FR5970IPMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and protection for the microcontroller, making it durable for various applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently in environments with high temperatures, ensuring reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficiency for processing tasks, enhancing the overall performance of the microcontroller.

ADC Channels: YES

Integrated Analog to Digital Converters allow for easy interfacing with analog sensors, expanding the range of applications for the microcontroller.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention, improving system efficiency.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast processing speeds, making the microcontroller suitable for applications requiring quick response times.

ROM Programmability: FRAM

Ferroelectric RAM technology enables fast and energy-efficient read/write operations, enhancing the performance and power efficiency of the microcontroller.

Low Power Mode: YES

Ability to operate in low power modes conserves energy and extends battery life, making the microcontroller suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430FR5970IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5970IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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