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MSP430FR5967IRGZT

Texas Instruments

MSP430FR5967IRGZT by Texas Instruments

MSP430FR5967IRGZT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. Featuring 16 ADC channels, 3 DMA channels, and 5 timers, it operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.444

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,215 parts In-Stock

1+ parts

$3.444

100+ parts

$2.808

1k+ parts

$1.872

10k+ parts

-

7,215

$3.444

$2.808

$1.872

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 535 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$3.272

-

-

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Vyrian

USA . 7,886 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

7,886

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,468 parts In-Stock

1+ parts

$3.100

100+ parts

-

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-

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1,468

$3.100

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AZTECH Wire

Italy . 284 parts In-Stock

1+ parts

$20.370

100+ parts

-

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284

$20.370

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Microchip USA

USA . 2,359 parts In-Stock

1+ parts

$22.740

100+ parts

$22.600

1k+ parts

$22.530

10k+ parts

$22.460

2,359

$22.740

$22.600

$22.530

$22.460

Parana Technologies

USA . 180 parts In-Stock

1+ parts

$63.936

100+ parts

-

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-

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180

$63.936

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-

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DigiPath Technology Company

USA . 2,264 parts In-Stock

1+ parts

$70.401

100+ parts

$64.769

1k+ parts

-

10k+ parts

-

2,264

$70.401

$64.769

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ChromeModa Solutions

Germany . 4,093 parts In-Stock

1+ parts

$71.838

100+ parts

$58.907

1k+ parts

-

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4,093

$71.838

$58.907

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$71.838

100+ parts

$68.246

1k+ parts

$64.654

10k+ parts

-

1,245

$71.838

$68.246

$64.654

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QUARKTWIN TECHNOLOGY LTD

USA . 5,757 parts In-Stock

1+ parts

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5,757

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5967IRGZT microcontroller. Built by a trusted manufacturer, this versatile chip is at the forefront of cutting-edge technology in the microcontroller category. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers looking for high-quality performance and reliability. Experience the advantages of seamless connectivity, low power consumption, and advanced features that set this microcontroller apart from the rest. Upgrade your projects today with the MSP430FR5967IRGZT and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, providing flexibility in power supply options.

No. of Terminals: 48

Having a high number of terminals allows for versatile connectivity options and integration with various components.

ADC Channels: YES

The presence of Analog to Digital Convertor (ADC) channels enables the microcontroller to interface with analog sensors and signals.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast processing speed and responsiveness in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A microcontroller with Reduced Instruction Set Computing (RISC) architecture offers efficient and streamlined operation for power-sensitive applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, making it suitable for battery-powered devices.

ROM Programmability: FRAM

Ferroelectric Random-Access Memory (FRAM) allows for fast and reliable data storage and retrieval, enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430FR5967IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

40

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5967IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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